Physical Vapor Engineer

Staff Engineer - Physical Vapor Deposition (PVD) Zone Position Summary We are seeking a highly motivated and experienced Process Engineer to join our dynamic team. The successful candidate will be responsible for the process development, optimization, and maintenance of PSI's Physical Vapor Deposition (PVD) process zone for semiconductor device fabrication. This role requires strong technical expertise in thin film deposition, process characterization, film characterization, and problem-solving within a high-volume manufacturing environment. Responsibilities

• Develop, optimize, and maintain PVD process modules for reactive and non-reactive thin film sputtering and evaporation processing, including generating new recipes and implementing enhancements for existing products through cross-functional collaboration.
• Demonstrate autonomy in tool operation, troubleshooting, and root cause analysis to effectively address process deviations, yield excursions, and equipment issues.
• Perform metrology and characterization on metallic and dielectric thin films, utilizing statistical process control (SPC) and performance monitoring to ensure process stability and achieve thin-film targeted metrics.
• Design and execute experiments (DOE) to improve process windows, reduce defects, and enhance film properties.
• Perform process tool diagnostics to identify system faults and service options
• Maintain and qualify high-vac deposition systems with and associated pump and rate-of-rise and base pressure metrics
• Collaborate with adjacent processing teams to drive tool qualification, continuous improvement initiatives, and technological advancements.
• Generate and maintain detailed process documentation, including specifications, operating procedures, and training materials.
• Assemble reports and presentations for equipment and process development efforts
• Ensure compliance with all safety protocols and quality standards throughout process development and manufacturing. Qualifications
• Bachelor's or Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
• Minimum of 3 years of experience in semiconductor process engineering, with a focus on Sputtering and Evaporation systems.
• In-depth knowledge of thin film deposition techniques, including sputtering, evaporation (thermal and e-beam), and associated vacuum technologies.
• Hands-on experience with various Sputtering and Evaporation deposition equipment.
• Strong analytical and problem-solving skills, with a proven track record of resolving complex process issues.
• Experience with statistical analysis software and design of experiments (DOE).
• Excellent communication, interpersonal, and teamwork skills.
• Ability to work independently and as part of a multi-disciplinary team in a fast-paced environment. Preferred Qualifications
• Experience with advanced metallization schemes (e.g., Cr, NiCr, Ti, TiW, Au, SiO2).
• Familiarity with cleanroom protocols and semiconductor manufacturing practices.
• Knowledge of device physics and semiconductor fabrication flow.
• Previous experience with diagnosing and serving high-vac deposition tools Key Words
• Physical Vapor Deposition, E-beam Evaporation, Thin film deposition, Sputtering, Reactive sputtering, Ellipsometry, High-Vac Semiconductor Tools, Kurt J Lesker, Angstrom Engineering Equipment
• PVD Systems, Sputter Tool, Evaporation tool, Bruker and Zygo White Light Interferometer, JAW Ellipsometer, Microscope, vacuum pumps, cryogenic pump, turbomolecular pump

Benefits:

401(k) 401(k) matching Dental insurance Employee assistance program Flexible spending account Health insurance Health savings account Life insurance Paid time off Professional development assistance Referral program Retirement plan Tuition reimbursement Vision insurance

Education:

Bachelor's (Required)

Experience:

Semiconductor:

4 years (Required) Process engineering: 4 years (Required)

Work Location:

In person