Sr. Manager - Wet Process/Plating/CMP Development
Job
Texas Instruments
Lehi, UT (In Person)
Full-Time
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Job Description
- Change the world. Love your job.
- We're at the forefront of an exciting era of semiconductor innovation at Texas Instruments' LFAB in Lehi, Utah, home to our state-of-the-art 300mm manufacturing facility now ramping our most advanced 28nm analog and embedded process technology in the heart of the Silicon Slopes.
K-12 STEM
education. In this role, you'll work at the intersection of fundamental research and high-volume manufacturing, turning process innovations into production-ready technologies that power electronics everywhere. Texas Instruments is seeking a- CMP/Wet/Plating Process Development Sr. Manager
- Why TI?
- + Engineer your future.
- About Texas Instruments
- Texas Instruments Incorporated (
Nasdaq:
TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com . Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition.- Minimum requirements:
- + Master's in Chemical Engineering, Materials Science, Physics, or related field + 10+ years of semiconductor process development experience, with strong expertise in wet processing, plating, and/or CMP + Proven experience in advanced node development (28nm, 22nm, or below) + Deep understanding of one or more of the following: + CMP mechanisms and consumables + Wet etch and cleaning chemistries + Surface preparation and contamination control + Process integration and device interactions + Strong knowledge of SPC, DOE, and data analysis techniques •Preferred qualifications:•+ PhD in Chemical Engineering, Materials Science, Physics, or related field + Experience in embedded, analog/mixed-signal or power semiconductor technologies + Familiarity with TI product applications such as automotive, industrial, and embedded systems + Background in R D environments with successful technology transfer to manufacturing + Experience with automation, scripting, or data science tools for process optimization + Demonstrated ability to influence senior leadership and drive cross-functional alignment •
ECL/GTC Required:
- Yes
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