Power Integrity Engineer

Power Integrity Engineer Insight Global - 3.9 Carlsbad, CA Job Details Full-time $170,000 - $193,000 a year 1 day ago Benefits RSU Qualifications Teamwork Integrated circuits (ICs) Communications systems expertise (engineering specialty) Bachelor of Science Electromagnetic theory Collaboration with product development teams Electronic connectors ANSYS Master of Science RF signal diagnostics Electrical engineering training Design engineering Printed circuit board (PCB) layout Leading team collaboration initiatives Simulation tools Radio frequency (RF) testing Electrical Engineering Electrical connectors Cross-functional team management Cross-functional communication

Full Job Description Salary:

170k/yr-193k/yr + RSU and Bonus Onsite in Carlsbad

JOB DESCRIPTION

Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear's next generation products

• Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications
• Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 1.

6T/3.2T DSPs and TIAs) for data center connectivity and storage for AI applications

REQUIRED SKILLS AND EXPERIENCE

• BS in Electrical Engineering or related + 9 years of experience, or MS + 7 years of experience, or Ph.D. + 4 years of experience Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory
• Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors)
• Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI
• Understanding of S-parameters, Smith Chart, and frequency domain analysis
• Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers
• Expertise in time and frequency domain analysis using simulation tools like ADS, SPECTRE, etc.
• Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR
• Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams
• Self-motivated with ability to work effectively in both independent and team settings
• Strong communication, presentation, and documentation skills
• Excellent problem-solving skills and ability to excel in a fast-paced environment

NICE TO HAVE SKILLS AND EXPERIENCE

○ Experience with layout tools such as Cadence Allegro and APD ○ Understanding of different IEEE and Optical standards to define design guidelines ○ Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs, and optical drivers and multi-chip package design ○ Familiarity with IC design flows, floor-planning, IO ring design, on-chip decoupling, on-die EM/IR analysis ○ Understanding of different TX/RX circuit designs and how system SI/PI impacts such circuits. Use this knowledge to drive the design of packages and PCBs Expertise in equalization techniques such as FIR, CTLE, DFE, FFE and different types of noise in the system and channels and how to optimize EQ settings to mitigate them

Pay:

$170,000.00 - $193,000.00 per year

Work Location:

In person