PCB & Substrate Layout Engineer (On-Site Preferred)

PCB & Substrate Layout Engineer (On-Site Preferred) HRU Tech - 5.0 Phoenix, AZ Job Details Contract 13 hours ago Qualifications Technical documentation Testing and evaluation Electronics design CAM software Production validation processes Schematic diagram drawing Printed circuit board (PCB) layout Packaging design 3D modeling Production documentation Cross-functional communication Full Job Description Principal PCB & Substrate Layout Engineer Position Overview We are seeking an experienced Principal PCB & Substrate Layout Engineer to provide technical leadership and hands-on expertise in the design and development of advanced printed circuit boards, high-density substrates, and microelectronic packaging solutions. This role will support complex electronic systems requiring high-speed interfaces, high-density interconnect technologies, and advanced packaging architectures. The successful candidate will serve as a technical leader, driving layout excellence, supporting multidisciplinary engineering teams, and ensuring designs are optimized for performance, manufacturability, reliability, and quality. Key Responsibilities Technical Leadership Provide technical leadership for PCB and substrate layout activities focused on high-speed interfaces and high-density packaging technologies. Drive continuous improvement of layout methodologies, design processes, and best practices. Mentor engineers and layout designers while supporting complex development programs. PCB & Substrate Design Lead the design, layout, and analysis of complex electrical and mechanical systems, including: High-density interposers Advanced substrates Multi-layer PCBs Flip-chip architectures Digital, analog, power, and RF signal routing Develop designs utilizing: High-Density Interconnect (HDI) technologies Blind and buried vias Ball Grid Arrays (BGAs) Differential pair routing Controlled impedance structures Design for Test (DFT) Electromagnetic Compatibility (EMC) principles Perform stack-up development, impedance calculations, crosstalk analysis, and material selection studies. Support package material characterization and modeling, including: Skin effect analysis Surface roughness considerations Dielectric constant and loss evaluation Frequency-dependent material modeling Manufacturing & Supplier Support Apply Design for Manufacturing (DFM) principles and ensure layouts align with supplier capabilities. Develop fabrication documentation and drawings that accurately communicate design intent. Support fabrication and assembly suppliers throughout the manufacturing process. Validate manufacturing deliverables using CAM tools and industry best practices. Review artwork and manufacturing documentation throughout the design lifecycle. Cross-Functional Collaboration Participate in design reviews, manufacturing readiness reviews, and technical evaluations. Support multidisciplinary investigations, feasibility studies, and technology development efforts.

Collaborate with:

Electrical Engineering Mechanical Engineering Manufacturing Operations Quality Supply Chain Customers Suppliers and fabrication partners Provide technical guidance to internal and external stakeholders throughout product development. CAD & Documentation Responsibilities Create and maintain assembly drawings using AutoCAD. Develop, manage, and maintain DX Designer/CAE component libraries. Coordinate CAD data and design packages with external PCB layout vendors. Define and implement CAD methodologies, software applications, and design standards. Develop automation scripts and utilities to improve engineering tool efficiency. Ensure fabrication drawings accurately reflect engineering requirements and specifications. Support footprint development and component library management for PCB design. Provide schematic support to the Electrical Engineering organization. Evaluate supplier capabilities and support material, equipment, and service selections. Required Qualifications Bachelor's degree in Engineering or equivalent combination of education and experience. Minimum 10 years of experience in PCB and/or high-density package layout design. Expert-level experience with Cadence APD+ (Allegro) and associated layout tools. Experience with APD+ Physical and Electrical Constraint Editor.

Extensive experience designing:

High-Density Interconnect (HDI) structures Blind and buried micro-vias Specialty RF dielectric materials Fine-line routing technologies down to 2m/2m geometries Experience with advanced packaging technologies including: 2.5D devices Interposer design Substrate design Flip-chip packaging Die stacking Package stacking Substrate stacking Experience with schematic and netlist-driven layout processes. Strong understanding of digital, analog, and RF layout methodologies. Knowledge of electronic packaging technologies and advanced semiconductor packaging concepts. Experience collaborating with Mechanical Engineering teams on 3D modeling, fit checks, and thermal integration. Experience using CAM tools for manufacturing validation. Working knowledge of JEDEC and IPC standards for design, fabrication, and assembly. Experience creating fabrication packages and assembly documentation. Preferred Qualifications Experience with CAM350, Blueprint, or similar manufacturing validation tools. High-end FPGA package or board design experience. Experience supporting aerospace, defense, space, telecommunications, semiconductor, or other highly regulated industries. Familiarity with advanced microelectronics manufacturing processes. Experience supporting highly reliable or mission-critical electronic systems. Desired Skills Strong technical leadership and mentoring capabilities. Excellent analytical and problem-solving skills. Ability to evaluate complex technical issues and develop practical solutions. Strong communication and collaboration skills. Commitment to quality, execution, and continuous improvement. Ability to thrive in a fast-paced, multidisciplinary engineering environment. Systems-thinking mindset with the ability to understand impacts across the full product lifecycle. Willingness to support team objectives beyond individual areas of expertise. Additional Requirements Must be eligible to work in the United States. Ability to work effectively both independently and within cross-functional teams. EOE (including Disability/Veterans) #HRUProfessional