Photonics/RFIC Engineer - Open Rank (Mid-Level) - EOSL

Photonics/RFIC Engineer - Open Rank (Mid-Level) - EOSL Georgia Tech Research Institute (GTRI) tuition reimbursement United States, Georgia, Atlanta Apr 16, 2026

Overview:

The Georgia Tech Research Institute (GTRI) is the nonprofit, applied research division of the Georgia Institute of Technology (Georgia Tech).Founded in 1934 as the Engineering Experiment Station, GTRI has grown to more than 2,900 employees, supporting eight laboratories in over 20 locations around the country and performing more than $940 million of problem-solving research annually for government and industry.

GTRI's renowned researchers combine science, engineering, economics, policy, and technical expertise to solve complex problems for the U.S. federal government, state, and industry. Georgia Tech's Mission and Values Georgia Tech's mission is to develop leaders who advance technology and improve the human condition. The Institute has nine key values that are foundational to everything we do: 1. Students are our top priority. 2. We strive for excellence. 3. We thrive on diversity. 4. We celebrate collaboration. 5. We champion innovation. 6. We safeguard freedom of inquiry and expression. 7. We nurture the wellbeing of our community. 8. We act ethically. 9. We are responsible stewards. Over the next decade, Georgia Tech will become an example of inclusive innovation, a leading technological research university of unmatched scale, relentlessly committed to serving the public good; breaking new ground in addressing the biggest local, national, and global challenges and opportunities of our time; making technology broadly accessible; and developing exceptional, principled leaders from all backgrounds ready to produce novel ideas and create solutions with real human impact. Project/Unit Description The Photonics & Microelectronics Division (PMD) in the Electro-Optical Systems Laboratory (EOSL) of GTRI is searching for a Photonic IC Engineer, with significant experience in design, tapeout, and characterization. The Photonics and Microelectronics Division currently performs advanced research and development that involves novel photonic and RF system concepts; design & packaging of photonic integrated circuits and RF/millimeter-wave ICs; developing new materials and micro-electronic devices; and assembling spacecraft hardware. These components and sub-systems are used in a variety of applications, primarily in aerospace and national security platforms. The successful candidate will support work across the Division, as described in the Additional Responsibilities section. Job Purpose A Photonics Engineer advances and matures the state-of-the-art in integrated circuits that interact with electromagnetic signals. Their research centers on the development of RFICs and/or photonic IC (PICs) technology enabled through a diverse set of material systems, including Complementary Metal-Oxide Semiconductor (CMOS)-based silicon, silicon germanium (SiGe), and compound semiconductors (InP, GaAs, GaN and their associated ternary and quaternary compositions). The engineer is versed in the design and development of electronic, radio frequency, millimeter wave, and photonics design and development. Technology breakthroughs are achieved through a broad skill set covering numerous stages of the fabrication process including simulation, design, layout, packaging, and characterization of ICs, as well as integration into higher-level systems (such as board-level, component-level, and systems-level). The engineer works as part of a broad team of researchers to innovate new concepts, identify technology stakeholders, and execute challenging research in the national interest. Key Responsibilities Lead designer of RF/Analog IC project tasks Serves as a lead contributor and author to technical journals and publications Presents project presentations and technical reports under the supervision of more experienced engineers Significant contributions to technical reports and presentations Begin to take ownership of small team development, mentoring others Significant contributions to white papers and competitive proposals Supports sponsor engagements. Additional Responsibilities Conduct benchtop experiments in the optics laboratory using free-space and fiber optics, lasers, modulators, amplifiers, photodetectors, photonic integrated circuits, etc. Test, characterize, package custom ICs on a probe station Integrate custom photonic into functional circuit card assemblies Model and simulate optical systems, devices, and structures Required Minimum Qualifications Degree in electrical engineering, microelectronics, physics, applied physics, or closely related field B.S. with 5-8 years relevant work experience; or M.S. with 3-6 years relevant work experience, or Ph.D. with 0-3 years relevant work experience. Candidates currently enrolled in an accredited degree program for MS or PhD relevant to this position will be considered. The candidate must have a graduation date of no later than August 2026 Experience taping out PICs in a foundry process, including design, layout and characterization after fabrication. Experience with photonic component and system simulation software such as Lumerical, OptSim, VPI Photonics, Optodesigner, Cadence or similar. Experience with IC design and layout tools such as Cadence, Synopsis, or Klayout. Experience with common simulation tools such as MATLAB or Python Strong sense of curiosity in both the technical and non-technical aspects of working in applied research. Ability to obtain and maintain a DoD Secret Security Clearance Preferred Qualifications- Active Secret Clearance Multiple tapeouts of Photonic ICs in foundry processes such as silicon photonics, indium phosphide, or lithium niobate, including design, tapeout, and characterization of fabricated PICs. (Being specific on resume will be helpful) Research experience and understanding of radiation effects on discrete and integrated photonic components Additional capabilities in analog RF IC design, tapeout, fabrication, and characterization, in foundry processes such as GaN, GaAs, SiGe, etc. Additional capabilities in digital IC design in CMOS foundry processes. Working knowledge of semiconductor & CMOS device physics; reliability mechanisms; measuring & modeling failure analysis & reliability for discrete devices & ICs Characterization and test of bare RF die in a probe station; load pull measurements Ability to clearly communicate technical ideas to a non-technical audience Experience performing basic electrical and optical measurements using equipment such as spectrum analyzers, high-speed oscilloscopes, network analyzers, power meters, and signal analyzers. Strong knowledge of photonics design, fabrication, and device physics. Travel Requirements