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IC Package Integration Lead

Job

Apple

Emeryville, CA (In Person)

Full-Time

Posted 03/11/2026 (Updated 2 weeks ago) • Actively hiring

Expires 5/27/2026

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Job Description

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team.

Description
  • Work with cross-functional teams and lead package integration and architecture efforts.
  • Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
  • Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
  • People managerial skills highly desirable.
  • Travel - 5-10%\

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