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Packaging Substrate Engineer

Job

Apple

Emeryville, CA (In Person)

Full-Time

Posted 03/11/2026 (Updated 3 weeks ago) • Actively hiring

Expires 5/27/2026

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Job Description

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.

Description
  • Lead SoC package substrate technology development, pathfinding, and roadmap definition.
  • Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
  • Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
  • 5% International travel.
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