Senior Package Design Engineer

at Micron Technology, Inc. in Boise, Idaho, United States Job Description Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Summary Department Introduction:

Micron Technology, Inc. is a global leader in memory and storage solutions, delivering innovative technology from silicon to systems! The design engineering team develops advanced memory products by combining circuit design, package development, and system-level validation. The team works collaboratively across functions to deliver high-quality, reliable, and cost-effective solutions.

Position Overview:

As a Senior Package Design Engineer, you will design, develop, and optimize advanced semiconductor packages for memory and logic products. You will work with global, cross-functional teams to deliver scalable, high-performance solutions that meet product, manufacturing, and customer requirements. Responsibilities + Define and optimize package architectures for memory, logic, and analog products. + Perform parasitic modeling, validation, and design updates to improve performance and reliability. + Lead package layout activities, including floorplanning, placement, and routing for high-density designs. + Partner with simulation teams to validate electrical, thermal, and mechanical performance. + Collaborate with engineering, manufacturing, and product teams to support design for manufacturability. + Work with internal teams and external partners to address design, assembly, and production challenges. + Contribute to design standards, tools, and guidelines to improve team efficiency and quality. + Support development of next-generation packaging solutions for future memory technologies. Minimum Qualifications + Bachelor's degree in Electrical Engineering, Materials Science, or a related field, or equivalent practical experience. + 5+ years of experience in semiconductor package design, circuit design, or a related area. + Experience with package layout tools and design processes, including floorplanning and routing. + Understanding of electrical, thermal, and mechanical behavior in semiconductor packaging. + Experience working with multi-functional or global engineering teams. Preferred Qualifications + Master's degree + Experience with memory technologies such as DR To view full details and how to apply, please login or create a Job Seeker account