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Senior Package Design Engineer
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Micron Technology
Boise, ID (In Person)
Full-Time
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Job Description
Req ID:
JR102229
Senior Package Design Engineer Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ##Summary Department Introduction:
Micron Technology, Inc. is a global leader in memory and storage solutions, delivering innovative technology from silicon to systems! The design engineering team develops advanced memory products by combining circuit design, package development, and system-level validation. The team works collaboratively across functions to deliver high-quality, reliable, and cost-effective solutions.Position Overview:
As a Senior Package Design Engineer, you will design, develop, and optimize advanced semiconductor packages for memory and logic products. You will work with global, cross-functional teams to deliver scalable, high-performance solutions that meet product, manufacturing, and customer requirements. ## Responsibilities- Define and optimize package architectures for memory, logic, and analog products.
- Perform parasitic modeling, validation, and design updates to improve performance and reliability.
- Lead package layout activities, including floorplanning, placement, and routing for high-density designs.
- Partner with simulation teams to validate electrical, thermal, and mechanical performance.
- Collaborate with engineering, manufacturing, and product teams to support design for manufacturability.
- Work with internal teams and external partners to address design, assembly, and production challenges.
- Contribute to design standards, tools, and guidelines to improve team efficiency and quality.
- Support development of next-generation packaging solutions for future memory technologies. ## Minimum Qualifications
- Bachelor's degree in Electrical Engineering, Materials Science, or a related field, or equivalent practical experience.
- 5+ years of experience in semiconductor package design, circuit design, or a related area.
- Experience with package layout tools and design processes, including floorplanning and routing.
- Understanding of electrical, thermal, and mechanical behavior in semiconductor packaging.
- Experience working with multi-functional or global engineering teams. ## Preferred Qualifications
- Master's degree
- Experience with memory technologies such as DRAM or NAND.
- Experience using simulation tools for signal integrity, power integrity, or thermal analysis.
- Familiarity with semiconductor manufacturing and OSAT partners.
- Experience leading projects or influencing technical decisions across teams.
Semiconductor Design Eng MTS Relocation Level:
TBD Before Getting Started Please review Micron's Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs.Note in particular that:
- Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
- If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.