Package Design Engineer | Semiconductor

Package Design Engineer | Semiconductor Micross - 2.0 Durham, NC Job Details Full-time 22 hours ago Benefits Health savings account Paid holidays Health insurance Dental insurance Flexible spending account Tuition reimbursement Employee assistance program Vision insurance 401(k) matching Life insurance Pet insurance Qualifications Bachelor's degree in mechanical engineering 3D CAD modeling Bachelor's degree in electrical engineering Engineering Mechanical Engineering 8 years SoC Bachelor's degree Organizational skills Document archiving Senior level Electrical Engineering Cross-functional collaboration Semiconductor experience Communication skills Cross-functional communication Full Job Description Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility .

Essential Duties and Responsibilities:

The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up Work with IC design team to define IC package requirements Design package layout using standard CAD tools Extract package parasitics and conduct PI/SI analysis Documentation and release in appropriate archival system

Preferred Knowledge, Skills, And Abilities Layout:

Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.

Analysis:

Celsius PowerDC (IR Drop)

Sigrity Advanced SI II:

Analysis tools for Signal integrity of parallel busses (DDRx) and serial links (PCIe Gen x), including Package and PCB effects

Sigrity Advanced PI II:

Power Integrity tools (IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects RF / Microwave Design AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development Qualifications Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. 8 to 10 years of experience in semiconductor packaging design, modeling, and simulations Strong authority on Cadence Allegro Package Designer Plus (APD+) Experience on interposer and substrate layouts and design in advanced package technologies Experience with 2.5D, 3D package design Experience with design teams on floor plan, bump and layout optimization Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated Record of success in cross-functional team environment Good experience with SI/PI tools for package level extraction/simulation At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community. Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available. www.

Micross.com