Senior Engineer - Copper Hybrid Bonding

Job Description Our client, a global leader in materials and solutions for advanced electronics, is seeking a highly skilled and innovative engineer to lead our Copper Hybrid Bonding (CHB) development program. This role will focus on advancing next-generation interconnect technologies for high-performance packaging, leveraging deep expertise in grain engineering, copper bonding, and process integration. Key Responsibilities

• Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration.
• Define technical roadmap, milestones, and deliverables aligned with business objectives.
• Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes.
• Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB.
• Implement advanced characterization techniques (e.g., EBSD, TEM, AFM) to analyze grain orientation and bonding quality.
• Collaborate with global technology and commercial teams to promote technically differentiated Cu bonding technology.
• Act as the primary technical interface with customers to align bonding technology with product requirements.
• Partner with plating tool OEMs to evaluate, qualify, and optimize formulation for copper bonding and surface engineering.
• Identify opportunities for process differentiation and file patents to protect intellectual property.
• Stay ahead of industry trends and benchmark against leading-edge CHB technologies.

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.

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https://insightglobal.com/workforce-privacy-policy/. Skills and Requirements

• Master's degree in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field with a minimum of 4+ years relevant experience preferred.
• Or Ph.D. in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field, with 1+ years relevant experience preferred.
• Experience and knowledge in semiconductor packaging or interconnect technology development required.
• Proven expertise in grain engineering, copper bonding, and hybrid bonding processes.
• Hands-on experience with electrochemical deposition, CMP, and surface activation techniques.
• Strong analytical and problem-solving skills.
• Familiarity with reliability testing and failure analysis for bonded interfaces.
• Excellent communication and leadership abilities.
• Hands-on experience with hybrid bonding, TSV plating, and damascene metallization.
• Familiarity with additive chemistry development for electroplating baths.
• Knowledge of failure analysis, stress modeling, and reliability testing.
• Track record of patent generation and technical leadership.