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ElectroMechanical Packaging Engineer III
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Global Edge Group, LLC
Littleton, CO (In Person)
$123,425 Salary, Full-Time
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Job Description
Job Requirements Littleton, CO Secret Polygraph not specified Mid Level Career (5+ yrs experience) $89,300 - $157,550 Job Description The Global Edge Consultants, LLC is an Equal Opportunity Employer. The Global Edge Consultants, LLC does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, non-disqualifying physical or mental disability, national origin, veteran status or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.
SRR design phase. Help define requirements and provide the framework for architecture and interface development and maintenance throughout the program lifecycle. Generate and release design disclosure artifacts including technical presentations and end?of?year reports. Work on a cross-functional team in the development and integration of avionics systems. Develop electronic enclosure designs, performance and test requirements, and support stress and thermal analysis. Participate in iterative design reviews and boards such as Engineering Material Review Board (EMRB) and Failure Review Board (FRB) as required. Resolve test anomalies and support system-level testing.
Job Title:
ElectroMechanical Packaging Engineer III Location:
Englewood or Littleton, CO (Onsite Only)Type of Role:
Direct Hire (Full-Time, Onsite)Shift:
9x80 Schedule (Every other Friday off)Pay:
The annual base salary range for this position in California, Massachusetts, and New York (excluding most major metropolitan areas), Colorado, Hawaii, Illinois, Maryland, Minnesota, New Jersey, Vermont, Washington or Washington DC is $89,300 - $157,550; for other states, the range will reflect the candidate's final work location, and final offers consider the scope and responsibilities of the position, candidate's work experience, education/training, key skills, and market and business factors.POSITION OVERVIEW
This role is for an experienced ElectroMechanical Packaging Engineer III on the Fleet Ballistic Missile Avionics team, focused on circuit card and electronic enclosure packaging for space flight avionics hardware. You will work closely with senior engineers to develop preliminary 3D concept models of avionics hardware and advance them for flight use, supporting trade studies, enclosure design, integration, and manufacturing for world?class avionics systems.RESPONSIBILITIES AND ESSENTIAL DUTIES
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations. Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to ensure compliant, robust designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. Establish specifications for contract assemblers and raw-material vendors. Interface with Parts Engineering, Quality Assurance, and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements while working within an Integrated Product Team environment. Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed. Identify initial physical architecture for the avionics subsystem. Assist with R D trade studies during the Pre?SRR design phase. Help define requirements and provide the framework for architecture and interface development and maintenance throughout the program lifecycle. Generate and release design disclosure artifacts including technical presentations and end?of?year reports. Work on a cross-functional team in the development and integration of avionics systems. Develop electronic enclosure designs, performance and test requirements, and support stress and thermal analysis. Participate in iterative design reviews and boards such as Engineering Material Review Board (EMRB) and Failure Review Board (FRB) as required. Resolve test anomalies and support system-level testing.