Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0

Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0 University of Southern California United States, California, Los Angeles Apr 23, 2026 ESSENTIAL

FUNCTIONS

• Support semiconductor prototyping projects from technical intake through fabrication, metrology, packaging coordination, and production handoff.
• Translate customer requirements into executable fabrication process plans and assist with feasibility assessments.
• Serve as a technical liaison to partner university nanofabrication facilities and industry fabs; participate in recurring technical progress reviews.
• Assist with process development, recipe documentation, troubleshooting, and yield improvement efforts in nanofabrication environments.
• Coordinate wafer-to-package transitions and collaborate with packaging partners on assembly and test requirements.
• Support process transfer and readiness assessments across partner facilities.
• Collaborate with internal research teams on data-driven process optimization and AI/ML-enabled manufacturing analytics.
• Maintain documentation of process flows, metrology results, and partner capabilities.

MINIMUM QUALIFICATIONS

• Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field and 5+ years of industrial semiconductor fabrication experience;
• Working knowledge of semiconductor device physics and fabrication fundamentals.
• Experience supporting process development, troubleshooting, or yield improvement in a fabrication facility.
• Strong written and verbal communication skills and ability to collaborate across technical teams.
• Candidate must be a U.

S. Person (U.S. citizen or lawful permanent resident).

PREFERRED QUALIFICATIONS

• Master's degree in a related field and 2+ years of industrial semiconductor fabrication experience; OR
• PhD in a related field with 0-5 years of post-degree experience.
• Hands-on experience in micro- or nanofabrication (lithography, deposition, etch, metrology)

MOSIS 2.0

seeks a Microelectronics Fabrication & Process Integration Engineer to translate innovative semiconductor process designs into fabricated and packaged hardware through a network of university and industry fabrication partners. This hybrid, customer-facing role supports semiconductor process prototyping projects from technical intake through fabrication and production handoff, coordinates with partner nanofabrication and packaging facilities, and contributes to data-driven process optimization initiatives. Job

ID REQ20173556

Posted Date 04/22/2026 Apply Current employees apply here