Front End Central Product Integration Engineer Test & Product Yield Integration (Senior / Staff / Principal)

Req ID:

JR96896 Front End Central Product Integration Engineer - Test & Product Yield Integration (Senior / Staff / Principal) Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ### Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of data into intelligence to drive progress worldwide! ### As a Central Product Integration Engineer, you will provide technical leadership across Micron's global network to drive yield, product quality, and successful New Product Introduction (NPI). Operating at the intersection of Test, Product, Yield, Front‑End Manufacturing, and Packaging/BEOL integration, this role requires strong cross‑functional collaboration and the ability to translate complex technical challenges into scalable, network‑wide solutions. You will work closely with teams across the U.S., Japan, Taiwan, and Singapore to meet aggressive performance, quality, and reliability targets. Come join an amazing team! ### ## ## ## Key Responsibilities

• Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
• Integrate and drive execution of cross‑site project data (design, test, yield, manufacturing) to closure.
• Deliver yield improvements through end‑to‑end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
• Define and execute strategies to ensure Packaging Technology and Chip‑Package Interaction readiness ahead of product qualification.
• Lead cross‑functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy best‑known methods (BKMs) and business processes to improve productivity.
• Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment. ## Minimum Qualifications
• Bachelor's, Master's, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
• 2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.
• Ability to work independently in a cross‑functional, global environment, manage multiple priorities, and travel 20-50%. ## Preferred Qualifications
• Experience with DRAM High Bandwidth Memory (HBM) products.
• Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout topics.
• Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
• Demonstrated ability to drive alignment and execution in central or network‑level roles.
• Strong interest in innovation, continuous improvement, and scalable solution development.

Job Profile(s): FAB Engineer 4

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