Advanced Packaging Engineer

Piper Companies is seeking an Advanced Packaging Engineer to support a leading organization in the semiconductor and high‑performance hardware industry. The Advanced Packaging Engineer role is ideal for an experienced engineer with strong expertise in organic substrate technologies, module integration, and advanced packaging collaboration with overseas partners. Responsibilities of the

Advanced Packaging Engineer:

• Support advanced semiconductor packaging activities involving organic substrates and multi‑layer substrate designs.
• Lead or contribute to module integration workflows aligned with high‑performance compute packaging requirements.
• Partner with Taiwan subcontractors to ensure alignment on build readiness, process workflows, and quality requirements.
• Collaborate on engineering initiatives involving TSMC engagement and CoWoS (Chip‑on‑Wafer‑on‑Substrate) technologies.
• Interface cross‑functionally with design, manufacturing, and supply chain teams to validate substrate and module requirements.
• Review substrate stack‑ups, interconnect requirements, and packaging design constraints.
• Drive continuous improvements in packaging workflows, quality processes, and cross‑team communication.
• Work onsite in Saratoga to support development, integration, and hands‑on engineering coordination.

Qualifications of the

Advanced Packaging Engineer:

• Strong expertise with organic substrate packaging and multi‑layer substrate concepts.
• Experience supporting module integration within semiconductor or advanced hardware environments.
• Familiarity with TSMC engagement processes and CoWoS or similar advanced packaging technologies.
• Ability to coordinate effectively with Taiwan subcontractors on packaging, materials, or integration workflows.
• Solid understanding of substrate stack‑up concepts, interconnect structures, and packaging constraints.
• Strong communication skills with the ability to work cross‑functionally in fast‑paced engineering environments.
• Proven track record of quality, consistency, and collaborative engineering execution.
• Must be able to work onsite in Saratoga. Compensation for the Advanced Packaging Engineer includes:
• Salary range: $200,000 - $250,000
• Comprehensive benefits package including medical, dental, vision, 401(k), and PTO This job opens for applications on 05/3/2026.

Applications for this job will be accepted for at least 30 days from the posting date. #LI-AR2 #LI-ONSITE