NEOTech's Chatsworth facility runs microelectronics and electronics assembly manufacturing for its customers. This Process Engineer II owns the processes behind that production equipment — screen printer, pick & place, reflow, wave, selective soldering, AOI, and 5DX — developing, optimizing, and sustaining microelectronics assembly processes to meet yield, reliability, and customer requirements. Hands-on microelectronics process engineering experience is a requirement , not a nice-to-have. The last sourcing round surfaced strong general manufacturing and chemical/industrial process candidates, but none with direct microelectronics or SMT assembly experience — this job description and the sourcing channels should screen for that specifically going forward. Essential Duties and Responsibilities Program, troubleshoot, and maintain manufacturing process equipment referenced in the Summary section. Develop, optimize, and sustain microelectronics assembly processes to meet yield, reliability, and customer requirements. Support engineering initiatives evaluating solders, fluxes, epoxies, and new equipment installations; recommend solutions both tactically and strategically. Monitor and maintain aqueous cleaner and ionic contamination testing equipment to acceptable standards, conforming to customer/IPC requirements. Initiate process improvements through evaluation of test/yield data and manufacturing defects, and make adjustments to process equipment accordingly. Create, present, and obtain approval for capital investment programs. Work with Production to develop and direct opportunities that affect revenues, costs, and processes. Prepare and submit reports as required. Provide guidance to machine operators and production employees; show alternate methods of solving or preventing process, business, or technical problems. Interact with other functional and business groups or outside vendors. Comply with Environmental Health and Safety regulations. Support and follow all ISO standards related to NEOTech's Quality Management Systems (quality, environment, health, safety, and security). Support all corporate and site 6S objectives. Perform all other duties as assigned. Required Qualifications 3-5 years of hands-on process engineering experience specifically in microelectronics or electronics assembly manufacturing (SMT lines). General industrial, mechanical, or chemical process engineering experience alone does not meet this requirement. B.S. in Engineering, Science, or Math. Hands-on experience programming, troubleshooting, and maintaining SMT/microelectronics assembly equipment: screen printer, pick & place, reflow, wave, selective soldering, AOI, and 5DX. Working knowledge of Surface Mount Technology (SMT), wave soldering technology, and documentation control.

IPC-A-610

(Modules 1 & 2) and

IPC-DVD-64C

Component Identification — currently certified, or able to certify within 90 days of start. Due to ITAR and / or CUI compliance, this position requires candidates to be a U.S. Citizen or U.S. Permanent. Preferred Qualifications Experience with lead-free soldering processes. Experience with aqueous cleaner and ionic contamination testing to IPC/customer standards. Experience evaluating solders, fluxes, and epoxies, and leading new equipment installation and qualification. Experience preparing and presenting capital investment proposals.

Pay:

$90,000.00 - $105,000.00 per year

Work Location:

In person