Signal Integrity (advanced), High-Speed Circuit Design (advanced), Transmission Line Theory (advanced), SI Simulation/Analysis (intermediate), 2D/3D Field Solvers (intermediate), Laboratory Testing (intermediate) Simulation Tools - HSPICE, ADS, Cadence (advanced)
Contract Type:
W2
Only Duration:
12 months with possibility of extension
Location:
RESEARCH TRIANGLE PARK, NC
(Onsite)
Pay Range:
$55-$58/hr on W2
Job Summary:
This role provides engineering support for operations and manufacturing production. The Signal Integrity Engineer will be responsible for ensuring signal integrity across high-speed circuits and PCB/package designs, utilizing simulation tools and laboratory equipment to validate hardware performance. The position requires collaboration with design and manufacturing teams to identify and resolve signal integrity issues while meeting project timelines.
Key Responsibilities:
Perform signal integrity analysis on high-speed PCB and package designs. Conduct simulations using 2D/3D field-solver tools and SPICE-based platforms. Validate hardware designs through laboratory testing with TDR, oscilloscopes, and VNA equipment. Collaborate with design and manufacturing teams to resolve signal integrity issues. Support production operations with engineering expertise and troubleshooting. Document analysis methodologies and design guidelines for team reference.
Must-Have Skills:
Bachelor's or Master's degree in Electrical Engineering or a related field. 3-5 years of relevant experience in Signal Integrity or Hardware Design. Strong knowledge of transmission line theory and high-speed circuit fundamentals. Experience with signal-integrity simulation and 2D/3D field-solver tools. Strong analytical, troubleshooting, and communication skills
Industry Experience:
Experience with laboratory equipment such as oscilloscopes, TDR, or VNA. Experience with IBIS, HSPICE, ADS, MATLAB, Cadence PowerSI AC/DC, or Allegro. Exposure to high-speed interfaces and links such as SerDes, LVDS, CML, DDR, NRZ, or PAM4, including high-speed PCB/package development or PI analysis.
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