Engineering Manager - Molding and Packaging at QP Technologies Engineering Manager - Molding and Packaging at QP Technologies in Escondido, California Posted in 1 day ago.

Type:

full-time Company Overview QP Technologies (formerly Quik-Pak), a division of Promex is a family-owned microelectronics assembly and product company based in Escondido, California. Founded in 1992, QP Technologies serves over 400 customers annually and is a trusted U.S. provider of on-shore, quick-turn semiconductor packaging services supporting new device and product development. Demand is growing concurrent with expansion of U.S. microelectronics, defense, and aerospace sectors and domestic reshoring prioritization.

Position Summary:

This hands-on leader owns end-to-end process development, refinement and sustainment of our high mix/volume microelectronics packaging technology.

Most critically, the successful applicant will leverage their core competencies in fundamental Engineering principles to design and scale a world-class Molding operation, manage the team, and influence end-to-end microelectronics process solutions for customers in our Escondido, CA factory.

Essential Duties:

Benchmark our existing Molding process and toolset by identifying root causes impacting product quality and yield at a first principles level through detailed problem solving and supporting data analysis Use design of experiments to identify and validate best consumables such as mold compound, cleaning agents, and epoxies Develop optimized recipes that cater to a range of products and form factors while creating a strong process with margin that caters for variations in product and materials Work with suppliers to simulate and design optimized overmold tooling Lead strategic selection and deployment of required capital equipment to scale process Adopt best known methods for process control that efficiently monitors process health over time, taking account of changeovers, preventive maintenance and event recovery Broaden your knowledge through hands-on experience to extend to other microelectronics manufacturing processes Establish DFM rules to ensure designs and process windows are aligned for cost, quality and throughput

Minimum Qualifications:

7+ years of experience in Transfer- or Injection-molding Manufacturing Engineering in a volume environment Bachelor's degree in Mechanical Engineering or equivalent Track record of solving complex problems Solid proficiency in SolidWorks for design work and revision control Solid proficiency in statistical process control

Key Competencies:

Microelectronics/medical/aerospace domain knowledge not required - strong curiosity and willingness to learn these spaces matters more Hands-on innovator who enjoys end-to-end product ownership involving complex systems Disciplined with excellent attention to detail and robust process control Strong written and oral communicator

Preferred Skills:

Experience with overmolding using thermoset materials (microelectronics applications are a plus), micro-molding, or accommodating complex parts comprised of mixed materials Ability to interact with and influence key stakeholders and transfer required knowledge to manufacturing team members charged with day-to-day running of the process Willingness to use experience and knowledge to expand the role and impact beyond the core focus area Familiarity with working in ISO 9001 and

ISO 13485

environments. Understanding of

AS 9100, 21 CFR

Part 820, and Good Documentation Practices (GDP).