Reliability & Yield Engineering Manager

Reliability & Yield Engineering Manager 3D Glass Solutions - 3.7 Albuquerque, NM Job Details Full-time 3 hours ago Qualifications JMP Semiconductor experience Statistical analysis tools Full Job Description Job/Position Summary We are seeking a Reliability & Yield Engineering Manager to lead yield improvement, process qualification, reliability validation, and failure analysis for an advanced substrate fabrication line. The role will support glass-core and organic-core substrate technologies, including TGV structures, RDL build-up, fine-line copper routing, dielectric build-up, plating, surface finish, and final electrical test. This position is critical to moving products from development through qualification, ramp, and production. The ideal candidate will combine strong process integration knowledge with hands-on reliability engineering, statistical analysis, defect reduction, and customer qualification experience. Primary Responsibilities Yield Engineering Lead yield improvement programs across the substrate fabrication flow, including glass core, TGV, build-up dielectric, copper plating, lithography, laser drilling, via formation, surface finish, and final electrical test. Develop yield Pareto analysis, defect density tracking, layer-level yield models, and inline-to-final-yield correlation. Drive root cause analysis for yield loss mechanisms. Establish and maintain process control plans, SPC charts, excursion management systems, and yield dashboards. Work closely with process engineering, equipment engineering, production, test, and quality teams to improve process capability and reduce scrap. Reliability Engineering Own reliability qualification planning and execution for substrate products, test vehicles, coupons, and customer programs. Define and manage reliability test plans, including 85°C/85%RH, biased HAST, temperature cycling, thermal shock, reflow simulation, MSL, high-temperature storage, insulation resistance, electromigration, electrochemical migration, CAF/dendrite testing, and mechanical reliability tests. Analyze reliability failures and correlate them back to process, material, design, and contamination sources. Run accelerated lifetime testing and extract activation energy and acceleration factor to develop reliability models of passive devices Process Qualification and Ramp Support Support process integration and product qualification for new substrate technologies, including glass substrates with TGV, ABF/polyimide build-up, fine-line RDL, ENEPIG or other surface finishes, and advanced packaging substrates. Work with design, process, test, and quality teams to define product-specific reliability requirements and acceptance criteria. Support transition from engineering lots to pilot production and high-volume manufacturing. Requirements Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or related field. Advanced degree preferred. 8+ years of experience in semiconductor packaging. This position will require lawful access to

ITAR/EAR

controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements. Knowledge, Skills, and Abilities A strong understanding of advanced substrate fabrication, glass or organic core substrates, copper plating and via metallization, RDL and fine-line lithography, surface finish processes, package-level reliability testing, and failure analysis. Experience with reliability standards and test methods such as JEDEC, IPC, AEC-Q, or customer-specific qualification requirements. Strong statistical analysis skills, including SPC, DOE, Cp/Cpk, GR&R, yield modeling, and data-driven root cause analysis. Must have strong analytical skills and be proficient in JMP analysis. Experience preparing customer-facing reliability reports, qualification documents, 8D reports, and corrective action plans. Experience with glass substrates, through-glass vias, TGV metallization, RF substrates, chiplet substrates, AI/HPC substrates, or advanced interposers is preferred. Hands-on knowledge of analytical tools such as SEM/EDS, FIB, X-ray, SAM, ion chromatography, profilometry, metrology, electrical test, and cross-section analysis is preferred. Experience ramping a new fab, pilot line, or advanced packaging manufacturing process is preferred. Familiarity with customer qualification for aerospace, defense, telecom, automotive, AI/HPC, or high-reliability electronics markets is preferred. Physical/Working Requirements Must be able to wear personal protective gear most of the day (where applicable). Prolonged periods of sitting or standing. Behavioral Traits Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders. A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments. The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.