Staff IC Packaging Engineer

##

Company:

Qualcomm Technologies, Inc. ##

Job Area:

Engineering Group, Engineering Group >

Packaging Engineering General Summary:

We are seeking a highly motivated Staff IC Packaging Engineer to lead the development and commercialization of advanced integrated circuit (IC) packaging technologies. This role focuses on driving innovation and enabling new product introductions. The ideal candidate will possess deep expertise in advanced packaging architectures and assembly processes, and will lead technology development from concept through high-volume manufacturing (HVM) in collaboration with Outsourced Semiconductor Assembly and Test (OSAT) partners. This position requires strong technical leadership, cross-functional collaboration, and the ability to solve complex engineering challenges. Duties and Responsibilities

• Lead development and deployment of advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration.
• Drive new product introduction (NPI) from concept to successful transfer into high-volume manufacturing.
• Define and optimize package architectures, including high-density interconnects, die-to-die (D2D) integration, and performance/reliability trade-offs.
• Develop and establish process flows, material sets, Best Known Methods (BKM), and process control plans.
• Design and execute Design of Experiments (DOE), test vehicles, and process characterization for technology development and qualification.
• Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align technology development with product requirements.
• Partner with internal design, modeling, and product teams to implement Design for Manufacturability (DFM) and establish design rules.
• Lead cross-functional programs, managing timelines, risks, and deliverables across multiple concurrent projects.
• Apply strong knowledge of FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development.
• Troubleshoot and resolve complex technical and manufacturing issues across development and production stages.

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.

OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience. Preferred Qualifications

• Advanced degree (M.S. or Ph.D.) in a relevant engineering discipline
• Strong expertise in:
• Flip Chip (CSP/FCBGA) and Wire Bond technologies
• System in Package (SiP) and module integration
• Redistribution Layer (RDL), wafer bonding, and advanced packaging (2.5D/3D)
• Experience with high-density interconnect design, substrate technologies, and package architecture
• Hands-on knowledge of assembly processes, materials, and equipment
• Familiarity with wafer-level processes, wafer-on-wafer bonding, and dicing technologies
• Understanding of reliability standards, qualification methods, and failure mechanisms
• Experience working with OSATs, foundries, and contract manufacturers
• Strong background in statistical data analysis and process optimization
• Knowledge of laser groove technology and wire bond process optimization is a plus
• Six Sigma Green or Black Belt certification is a plus
• Experience in IC packaging development and high-volume manufacturing Qualcomm is an equal opportunity employer.

If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all

Staffing and Recruiting Agencies:

Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer:

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and

Other Compensation & Benefits:

$154,000.00 - $231,000.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.