[About the Role] Join Lockheed Martin Missiles and Fire Control (MFC) as an Electro Mechanical Engineer and play a pivotal role in developing advanced hardware for mission-critical aerospace and defense systems. This position is not limited to CAD or drafting; you will own the full lifecycle of high-reliability electromechanical package design for missiles, sensors, and subsystems serving the U.S. and allied militaries. Contribute to high-impact projects, collaborate with cross-disciplinary experts, and advance your expertise in advanced packaging technologies. [Responsibilities]

• Lead package hardware design, including multichip device substrates, heat spreaders, attach mechanisms, and complex thermal management systems.
• Collaborate with mechanical and electrical engineers to create advanced Finite Element Analysis (FEA) and Multiphysics simulations for reliability and performance.
• Define and execute qualification plans compliant with JEDEC and

MIL-SPEC

standards.

• Investigate and conduct failure analysis on component interfaces; implement corrective actions and integrate lessons learned into future designs.
• Architect, design, and validate advanced circuit card packages and high-density interconnect solutions.
• Develop and optimize electromechanical systems for advanced, special, and IRAD programs.
• Drive and document design assurance reviews, track issues, and ensure closure of corrective actions.
• Perform comprehensive analyses for thermal, signal integrity, and electromagnetic compatibility in demanding defense environments.
• Partner with systems, hardware, software, test, and supply chain teams to deliver on schedule and within budget.
• Manage risk, schedule, and earned value metrics; report status to senior leadership. [Required Skills and Experience]
• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or related STEM field (Master's or PhD preferred), or 15+ years of relevant professional experience.
• Minimum 11 years' experience in 3D Heterogeneous Integration, advanced packaging, and microelectronics design.
• Proven leadership in high-reliability electronics product development and production.
• Proficiency in CREO modeling and electromechanical system design.
• Track record of project leadership and lifecycle management, including planning, estimation, staffing, and earned value management.
• Strong presentation, oral, and written communication skills.
• Experience collaborating with cross-functional, multi-location teams.
• Demonstrated ability to capture requirements for electromechanical designs. [Preferred Skills]
• Advanced degree (Master's or PhD) in relevant engineering discipline.
• Experience supporting Department of Defense programs.
• Hands-on experience with IRAD and special program development.
• Familiarity with JEDEC and

MIL-SPEC

qualification testing. [Benefits]

• Work on cutting-edge defense and aerospace technologies with global impact.
• Opportunities for career advancement and professional development.
• Competitive compensation and comprehensive benefits package.
• Collaborative, mission-driven work environment.
• Access to state-of-the-art tools and ongoing training. [How to Apply] Ready to make a difference? Submit your application via Lockheed Martin's careers page for the Engineering
• Design Engineer position in Orlando, FL (32819). Join us and help shape the technology that protects our nation and allies.

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