MTS Packaging Engineer
Job
Advanced Micro Devices, Inc
Austin, TX (In Person)
$163,200 Salary, Full-Time
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Job Description
Between $143k and
$184k
Per Year (Will discuss with applicant)
Position range in Travis County $70k
- $132k Per Year MTS Packaging Engineer Advanced Micro Devices, Inc
Occupation:
Materials EngineersLocation:
Austin, TX- 78735
Job Type:
Regular, Full Time (30 Hours or More), Permanent Employment, Day ShiftPosted:
04/30/2026 Positions available: 5Source:
WorkInTexasWeb Site:
WorkInTexas Onsite /Remote:
Not SpecifiedUpdated:
05/03/2026Expires:
06/04/2026 Job #: 17008696 Job Requirements and Properties Help for Job Requirements and Properties. Work Onsite Full Time Education Master's Degree Schedule Full Time Job Type Regular Duration Permanent Employment Hours 40 Hours Per Week Shift Day Shift Help for .Company:
Advanced Micro Devices, Inc.Position Title:
MTS Packaging EngineerWork Location:
7171 Southwest Parkway, Austin, TX 78735Wage:
$142,800- $183,600 per year Multiple Openings.
Job Duties:
Evaluate materials and components and processes for use in advanced semiconductor products that must meet specialized design and performance specifications in high volume semiconductor manufacturing. Drive for supplier engagement on continuous improvement and new capabilities ahead of need. Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders. Drive external manufacturer on issue resolution and issue prevention. Plan and execute change management from internal or external parties. Involved in regional supplier management- drive to meet Key Performance Indices. Coordinates market intelligent analysis to identify value engineering initiatives and derive short
- and long-term Value Engineering roadmap to support AMD product portfolio.
Requirements:
Masters degree or foreign equivalent in Mechanical Engineering, Computer Engineering, Electrical Engineering, or related field. Position requires experience in the following:- Flip Chip Packaging;
- Operational experience in bumping process, substrate manufacturing, Assembly manufacturing, and lid and stiffener manufacturing process;
- Development work leading to volume production in Semiconductor manufacturing;
- JMP and minitab tools;
- Failure analysis;
- Package reliability; and
- Industry standard (ESD, Jedec, Automotive).
Apply:
Submit application via workforce agency submission tool, or email resume to amdcandidates@amd.com and reference Job Title and Job Code 85558. At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD's Employee Stock Purchase Plan. You'll also be eligible for competitive benefits described in more detail.For more information visit https:
//careers.amd.com/benefits. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.Similar remote jobs
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