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Micron Technology
New College Grad - HBM SoC Design Engineer/Architect
Entry-Level JobVerifiedNo experience needed
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What they do
A Manufacturing Process Engineer develops workflow, work station, and equipment improvement recommendations within a company's manufacturing environment. Fine tunes manufacturing processes by researching, designing, modifying, and testing manufacturing methods and equipment. Evaluates manufacturing processes, applies knowledge of product design, fabrication, assembly, tooling, and material.
$139,535 / year median in California
-1% projected decline
Job Description
Req ID:
JR111456
New College Grad - HBM SoC Design Engineer/Architect Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ### ### About the Team At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions that enable advanced AI, high-performance computing, data center, and networking applications. Our team collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-centric SoC solutions that meet demanding power, performance, area, quality, and schedule objectives. ### ### Position Overview As an HBM SoC Design Engineer/Architect, you will contribute to the design, integration, and validation of advanced HBM logic die and memory-centric SoCs. Working alongside experienced engineers, you will apply knowledge gained through academic coursework, research, internships, and engineering projects to solve real-world semiconductor design challenges. This role offers opportunities to develop expertise in digital design, ASIC development, HBM architecture, and AI-enabled engineering methodologies that improve design productivity and quality. ### ### Responsibilities- Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions.
- Collaborate with architects and cross-functional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans.
- Support design-quality activities including simulation, synthesis, static timing analysis, clock-domain crossing (CDC) analysis, debugging, and design reviews.
- Evaluate power, performance, area, and timing tradeoffs to develop data-driven technical recommendations and improve design quality.
- Develop automation solutions and leverage AI Assisted workflows, Generative AI, Large Language Models (LLMs), or Agentic AI technologies to improve engineering productivity, verification efficiency, and design analysis. ### Minimum Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field completed prior to the employment start date.
- Academic, research, internship, or project experience in digital design, ASIC development, FPGA design, computer architecture, or a related discipline.
- Working knowledge of Verilog, SystemVerilog, VHDL, or another hardware description language.
- Understanding of digital design fundamentals including finite-state machines (FSMs), pipelining, clocking, reset strategies, timing concepts, and synchronous logic.
- Strong analytical, problem-solving, written communication, and verbal communication skills with the ability to work effectively in collaborative engineering environments. ### Preferred Qualifications
- Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related technical discipline completed prior to the employment start date.
- Coursework, research, internship, or project experience in SoC design, RTL development, design verification, physical design, embedded systems, or semiconductor technologies.
- Familiarity with synthesis, static timing analysis (STA), simulation, formal verification, UVM, FPGA prototyping, or industry-standard EDA tools.
- Understanding of memory systems and high-speed interfaces such as HBM, DDR, LPDDR, PCIe, or CXL.
- Experience with automation, AI Enabled development tools, Generative AI, Large Language Models (LLMs), AI Assistants, or Agentic AI solutions applied to semiconductor design, validation, or engineering workflows.
Relocation Level:
TBD Before Getting Started Please review Micron's Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs.Note in particular that:
- Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
- If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
For US Sites Only:
To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Benefits
- Paid Time Off (PTO)
- Health Insurance
- Dental Insurance
- Vision Insurance