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1010 Analog Devices Inc.
SiP Layout Design Engineer
Career Insights for Manufacturing Process Engineer
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Based on Massachusetts data
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What they do
A Manufacturing Process Engineer develops workflow, work station, and equipment improvement recommendations within a company's manufacturing environment. Fine tunes manufacturing processes by researching, designing, modifying, and testing manufacturing methods and equipment. Evaluates manufacturing processes, applies knowledge of product design, fabrication, assembly, tooling, and material.
$105,366 / year median in Massachusetts
-3% projected decline
Job Description
About Analog Devices Analog Devices, Inc. (
NASDAQ:
ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion inFY25, ADI
ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . We are looking for an experienced and detail-oriented SiP layout design engineer with strong expertise in laminate and PCB layout design for advanced semiconductor packaging applications. This role will support the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments.Candidates will be expected to:
Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions. Design and optimize routing, power and ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups to meet electrical, thermal, mechanical, and reliability requirements. Work closely with IC design, package engineering, and product engineering teams to ensure layout designs meet product specifications and package requirements. Perform design rule checks, layout verification, and design reviews to ensure compliance with package, substrate, PCB, and assembly design rules. Support layout feasibility studies, floor planning, package architecture selection, and design trade-off analysis for new package concepts. Generate and maintain layout databases, design documentation, fabrication drawings, stack-up drawings, and design review materials. Manage multiple layout projects, develop realistic layout schedules, track progress, and communicate status, risks, and issues to cross-functional teams. Qualifications Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related technical field. 5+ years of hands-on experience in laminate, substrate, PCB, or advanced package layout design. Strong understanding of laminate, substrate, and PCB layout principles, including routing, stack-up design, power/ground plane design, via design, impedance control, creepage/clearance, and manufacturability constraints. Strong knowledge of package structures, including BGA, LGA, flip-chip, system-in-package, multi-die packages, and module-based products. Proficiency in Cadence Allegro and CAD software. Familiarity with signal integrity, power integrity, thermal, mechanical, and reliability considerations in layout design. Ability to manage multiple projects, meet schedules, and deliver high-quality layout work with minimal supervision. Strong analytical skills, attention to detail, and ability to identify and resolve complex layout-related issues. Strong communication skills and ability to work effectively in cross-functional and global teams. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce- Bureau of Industry and Security and/or the U.S. Department of State
- Directorate of Defense Trade Controls. As such, applicants for this position
- except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3)
- may have to go through an export licensing review process.