SAW Process Engineer
- MEMS & Microfluidics Manufacturing Description
- The SAW Process Engineer is responsible for the development, qualification, and sustainment of wafer dicing and singulation processes used to separate silicon and other substrates into individual die.
This role provides technical ownership of precision mechanical cutting processes within a MEMS and microfluidics manufacturing environment and plays a critical role in ensuring yield, quality, and product reliability in high‑volume production. The position requires strong expertise in mechanical process engineering, brittle material handling, and manufacturing process control, with direct accountability for process stability, defect reduction, and continuous improvement. Key Responsibilities Own and sustain wafer singulation (SAW/dicing) processes used in MEMS and microfluidics manufacturing, including silicon and multi‑layer substrate cutting. Develop, qualify, and maintain process recipes and cutting strategies, including blade selection, cut parameters, and mechanical process windows. Provide manufacturing process engineering support for production operations, including rapid response to yield excursions and defect trends related to singulation. Lead root cause analysis for mechanical defects such as chipping, cracking, edge damage, delamination, or die breakage, and implement corrective actions. Define and maintain process controls, critical parameters, and monitoring strategies to ensure consistent performance and robust manufacturing output. Lead material, tool, and process change qualifications through formal change management and validation practices. Support new product introduction (NPI) activities requiring new or modified singulation approaches. Collaborate cross‑functionally with operations, quality, reliability, and product engineering teams to ensure alignment on manufacturability and risk mitigation. Create and maintain process documentation, technical specifications, and standard work to support long‑term process sustainability. Own production wafer and panel mounting processes, including tools, performance, and continuous improvement. Lead qualification and implementation of new tape materials to meet product demands and ensure supply continuity. Drive process control and development for UV-cure processes to ensure robust, scalable manufacturing. Required Qualifications Education Bachelor's degree in Mechanical Engineering (preferred), Materials Science, Manufacturing Engineering, or a related engineering discipline. Experience 3-5 years of process engineering experience in semiconductor, MEMS, or microfluidics manufacturing. Demonstrated hands‑on experience with wafer dicing / singulation (SAW) processes, including precision mechanical cutting of brittle materials. Experience supporting high‑volume manufacturing environments with strong focus on yield, quality, and process stability. Preferred Qualifications Experience with silicon wafer singulation, thin wafers, and multi‑layer or bonded substrate stacks. Understanding of mechanical stress, fracture mechanics, and damage modes associated with material removal processes. Experience implementing process controls, SPC, and structured problem‑solving methodologies. Familiarity with operating in cleanroom and semiconductor fabrication environments. Strong technical communication skills and ability to work across cross‑functional engineering and operations teams. Key Competencies Wafer dicing and singulation process engineering Mechanical process optimization Yield improvement and defect reduction Root cause analysis and continuous improvement Process documentation and change management Cross‑functional collaboration Cross-Org Skills
- Effective Communication
- Results Orientation
- Learning Agility
- Digital Fluency
- Customer Centricity Impact & Scope
- Impacts multiple teams and may act as a team or project leader providing direction to team activities and facilitates information validation and team decision making process. Complexity
- Responds to moderately complex issues within established guidelines. Disclaimer
- This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management. Job
- Engineering Schedule
- Full time Shift
- No shift premium (United States of America) Travel
- 25% Relocation
- Yes Equal Opportunity Employer (EEO)
- HP, Inc.
provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "
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