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Memory Design Engineer, HBM

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Micron Technology

Richardson, TX (In Person)

Full-Time

Posted 5 days ago (Updated 23 hours ago) • Actively hiring

Expires 6/7/2026

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Job Description

Req ID:
JR91774 Memory Design Engineer, HBM Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions - right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron's various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities
  • Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
  • Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
  • Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
  • Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
  • Prepare and maintain design documentation while giving to best‑known practices and departmental training.
  • Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
  • Lead layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
  • Prepare project status reports and lead design reviews to communicate progress and technical decisions. Minimum Qualifications
  • Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
  • Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
  • Strong analytical and problem‑solving skills with validated significant technical contributions and a record of innovation.
  • Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
  • Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market. Preferred Qualifications
  • Self‑motivated with strong problem‑solving abilities and an aim to discover new solutions.
  • Deep knowledge of industry‑specific technologies and competitive trends.
  • Excellent communication and interpersonal skills for multi-functional collaboration.
  • BS or MS in Electrical Engineering or related field plus 3 years of experience in DRAM design, product, or system.
Job Profile(s): Semiconductor Design Engineer 2 - Semiconductor Design Engineer 3
Relocation Level:
TBD Before Getting Started Please review Micron's Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs.
Note in particular that:
  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here.
For US Sites Only:
To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

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