Role Overview We are seeking a Simulation Engineer to model and optimize advanced electronics packages for high-performance computing and datacenter applications. The role focuses on thermal and thermomechanical simulation, with opportunities to contribute to other areas of multiphysics modeling. You will develop models to understand how package architecture, materials, interfaces, and mechanical deformation affect thermal performance. Your work will span heat transfer, mechanical stress, warpage, and contact mechanics, with a focus on using simulation to guide real engineering decisions. We're looking for an engineer with strong simulation fundamentals, physical intuition, and an interest in advanced semiconductor packaging. Experience with semiconductor packages and their unique thermal and mechanical challenges is highly valued, as is experience solving similar problems in other engineering applications. Key Responsibilities Develop thermal and thermomechanical simulation models using ANSYS Icepak, ANSYS Mechanical, and related tools. Analyze heat transfer, mechanical stress, deformation, warpage, and contact mechanics in advanced electronics packages. Investigate how package geometries, materials, interfaces, and mechanical deformation influence thermal performance, including the behavior of thermal interface materials (TIMs). Model advanced package architectures, including chiplets, interposers, HBM, and 2.5D/3D integration. Build parameterized models and perform sensitivity analysis, design-space exploration, and optimization to identify important design tradeoffs. Develop physically meaningful simulation approaches, including appropriate assumptions, boundary conditions, and material properties. Collaborate with experimental teams to validate models against hardware measurements and improve simulation accuracy. Use simulation results to guide the design of new materials, thermal interfaces, and package architectures. The role may also involve electrical simulation (including signal and power integrity), fluid dynamics, and broader system-level thermal modeling, depending on your background and interests. Required Qualifications B.S. in Mechanical Engineering, Materials Science, Applied Physics, Electrical Engineering, or a related field. 2+ years of relevant industry or research experience in thermal, mechanical, or multiphysics simulation. Relevant graduate research may substitute for industry experience. Strong fundamentals in heat transfer, solid mechanics, and thermomechanical behavior. Hands-on experience with simulation tools such as ANSYS Mechanical, ANSYS Icepak, COMSOL, Abaqus, or similar software. Ability to formulate physical problems, select appropriate modeling approaches, and critically evaluate simulation results. Strong problem-solving skills, physical intuition, and ability to learn new technologies and simulation methods. Preferred Qualifications M.S. or Ph.D. in a relevant engineering or scientific field. Experience with advanced semiconductor packaging, including chiplets, interposers, HBM, substrates, and 2.5D/3D integration. Experience with package warpage, thermal interface materials, contact mechanics, or thermomechanical stress. Experience with nonlinear mechanical analysis, temperature-dependent material properties, or coupled multiphysics simulation. Experience using simulation for design optimization, sensitivity analysis, or design of experiments (DOE). Experience correlating simulation predictions with experimental measurements. Experience with electrical simulation, including signal integrity (SI) or power integrity (PI). Experience with CFD, conjugate heat transfer, or electronics cooling. What We Value We value engineers who combine strong technical fundamentals with curiosity, creativity, and practical engineering judgment. The most important skill is the ability to understand a physical problem, identify the important variables and assumptions, develop a useful model, and interpret the results. Our work involves emerging materials and advanced packaging technologies, so the ability to approach unfamiliar problems and develop new modeling methods is especially important. We value both specialized experience and the ability to apply knowledge from other fields to new engineering challenges.

Pay:

$140,000.00 - $180,000.00 per year

Benefits:

401(k) Dental insurance Flexible schedule Health insurance Health savings account Life insurance Paid time off Retirement plan Vision insurance Ability to

Commute:

Newark, CA 94560 (Required)

Work Location:

In person