Job Overview seeking a highly experienced Senior Electro-Mechanical Engineer to support advanced aerospace and defense technology programs. This position focuses on the design and development of high-reliability electronic hardware, with an emphasis on 3D Heterogeneous Integration (3DHI), advanced microelectronics packaging, thermal management, and electromechanical system design. The ideal candidate has a strong background in microelectronics, hands-on experience with CREO, and a proven ability to lead complex engineering projects from initial design through production.

Important:

This is a senior-level engineering position, not a CAD or drafting-only role. Candidates must have substantial electromechanical engineering and advanced packaging experience. Key Responsibilities Design and develop advanced microelectronics packages, including multichip devices, substrates, heat spreaders, stiffeners, and thermal management systems. Lead mechanical and electromechanical design efforts involving 3D Heterogeneous Integration (3DHI) and advanced packaging technologies. Use CREO to develop and validate complex electromechanical designs. Collaborate with engineering teams on finite element analysis (FEA), thermal simulations, mechanical stress, shock, vibration, and reliability testing. Design high-density circuit card assemblies, printed wiring boards, cable assemblies, and electronic interconnects. Develop and execute hardware qualification and reliability testing plans in accordance with JEDEC and

MIL-SPEC

standards. Investigate hardware failures, including solder joint cracking, delamination, and substrate warpage, and implement corrective actions. Support thermal, signal integrity, and electromagnetic compatibility (EMC) analysis. Lead engineering design reviews, technical risk assessments, and problem resolution. Manage engineering projects through design, development, testing, qualification, and production. Coordinate with electrical, mechanical, systems, manufacturing, test, and supply chain teams. Track project schedules, budgets, technical requirements, and earned value management (EVM) metrics. Required Qualifications Candidates must have at least 11 years of relevant professional experience , including demonstrated expertise in: 3D Heterogeneous Integration (3DHI) Advanced microelectronics packaging Microelectronics design and development CREO modeling and electromechanical system design Designing and producing high-reliability electronic hardware Technical leadership or project management throughout the engineering and production lifecycle Engineering planning, scheduling, cost estimating, risk management, and earned value management (EVM) Developing and documenting electromechanical design requirements Working with multidisciplinary engineering teams across multiple locations Communicating technical information to engineering teams, leadership, and customers

Education Requirements:

Bachelor of Science in Electrical Engineering, Mechanical Engineering, or a closely related STEM discipline from an accredited institution. Candidates without a degree must have at least 15 years of professional experience in electromechanical engineering or a related discipline. Preferred Qualifications Master's degree or PhD in a relevant engineering field Experience with FEA and multiphysics simulation tools Knowledge of JEDEC and

MIL-SPEC

qualification standards Experience with semiconductor packaging reliability and failure analysis Background developing electronics for aerospace, defense, or other high-reliability applications Experience leading engineering design reviews and multidisciplinary hardware development programs We are an equal opportunity employer and will consider all applicants for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran, disability and/or other protected categories. We are also committed to providing reasonable accommodation(s) to qualified individuals with disabilities or needs, as required by law.

INDBOS Pay:

$73.00 - $93.94 per hour Expected hours: No less than 40.0 per week

Work Location:

In person