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Process and Tooling Engineer

Job

Hewlett-Packard Development Company, L.P

Corvallis, OR (In Person)

$93,725 Salary, Full-Time

Posted 2 weeks ago (Updated 2 days ago) • Actively hiring

Expires 7/15/2026

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Job Description

Process and Tooling Engineer Description
  • This role is responsible for designing portions of engineering solutions (tooling and processes) and collaborating with internal and outsourced development partners.
The role implements and validates test plans, conducts feasibility studies, and evaluates tooling suitability and effectiveness (DFM). The role involves managing relationships with partners and suppliers, providing technical guidance, and addressing cross-functional challenges through basic foundation of a function's principles, theories and concepts. Responsibilities
  • Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines.
  • Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderate to complex products.
  • Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, process capability and margins.
  • Evaluate the failures of parts, tooling, or components and determine the root cause of failures.
  • Analyzes, optimizes, builds, tests, and refines rapid prototypes which integrate electrical, mechanical and software components.
  • Conducts feasibility studies, design margin and validation analyses and empirical testing on new and modified designs.
  • Manages relationships with outsourced partners and suppliers, on mechanical and thermal design and development, including setting expectations regarding deliverables, product quality, schedules, and costs.
  • Provides technical guidance to vendor teams in the resolution of challenges, support program level efforts.
  • Identifies and resolves challenges with the cross functional teams using technical experience and judgment and precedents and maintains all mission critical data center related mechanical system design requirements.
Education & Experience Recommended Four-year Degree in Mechanical Engineering, Manufacturing Engineering, or any other related discipline or commensurate work experience or demonstrated competence. Typically has 0-4 years of work experience, preferably in engineering design and solutions, implementation across process development lifecycle, or a related field. Knowledge & Skills
  • 3D Modeling (CREO, SolidWorks, Inventor….)
  • Ansys Simulation Software
  • Computer-Aided Design
  • Electromechanics
  • Engineering Design Process
  • Finite Element Methods
  • Injection Molding
  • Machining
  • Manufacturing Processes
  • Mechanical Design
  • Mechanical Engineering/Machine design fundamentals
  • Mechanical Systems
  • New Product Development (Design for Manufacturing)
  • Product Design
  • Prototyping
  • CAD
  • Sheet Metal
  • Statistical Process Control/Engineering Statistics/Sig Sigma/Lean Manufacturing Cross-Org Skills
  • Effective Communication
  • Results Orientation
  • Learning Agility
  • Digital Fluency
  • Customer Centricity Impact & Scope Impacts own work and acts as a team member by providing information, analysis, and recommendations in support of team efforts.
The pay range for this role is $73,800 to $113,650 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview [https://hpbenefits.ce.alight.com/]) The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law. Job
  • Engineering Schedule
  • Full time Shift
  • No shift premium (United States of America) Travel
  • 25% Relocation
  • Yes Equal Opportunity Employer (EEO)
  • HP, Inc.
provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "
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