Research & Development Engineer

• Description
• Job Description HP's Specialty Printing and Technology Solutions business unit is chartered to leverage HP's printing technology assets to OEM's in a wide array of markets including Product Identification, Labels, Transactions, Postage, Mail Addressing, and Life Sciences markets.

We repurpose these assets to address needs in vertical markets where HP's technology, performance, and reliability can bring value. The SPTS Engineering Organization is chartered to extend these assets with high-ROI solutions that fit the needs of these markets through specialty inks, printheads, enablers and full imaging solutions. Tremendous opportunities exist to leverage HP print technologies and apply them to create new applications in the Life Sciences. The SPTS Life Science Dispense business is one new Life Science business that HP has already launched. We develop and sell dispensing products that leverage HP's world-class inkjet printing technology.

• Job Summary
• This position is for a Mechanical Engineering (ME) design engineer.

You will be part of a core group of design engineers developing new, disruptive technology and products. The role spans product layout and component/subsystem design, early prototyping, assembly tools and methods, and scaling designs into production-ready solutions through established product development processes. Work is dynamic and may change as needs evolve in a fast-paced, lean, collaborative environment. You may lead technical work direction for product design, test tools or assembly tooling, including defining technical metrics and specifications to support program goals, assigning work to supporting engineers, developing and tracking technical milestones, and creating forums/structures for integration across internal teams and external/ODM partners. You will drive issue resolution and provide regular status updates to senior stakeholders.

• Responsibilities
• + Design components, subsystems, and portions of engineering solutions for mechanical, electrical, optical, and fluidic systems.

+ Create designs using CAD; perform product layout and detailed part/assembly design. + Develop specifications and manage technical interfaces/boundaries between systems and subsystems. + Plan and execute (or implement established) test and validation methods, including form/fit/function, tolerances, shock and vibration, EMI, safety, reliability, thermal generation, and system power measurements. + Own components and subsystems through early technology development: idea conception, prototyping, experimentation, and maturation into production-ready solutions. + Support development of assembly tools, assembly methods, and process flows within internal labs and at outsourced/ODM integration partner manufacturing sites. + Collaborate cross-functionally across teams, geographies, and external/ODM partners to integrate designs. + Track and resolve technical issues; communicate status, risks, and mitigation plans with cross-functional partners.

• Education & Experience
• Recommended
• + Bachelor's or Master's degree in Mechanical Engineering (or related field with a proven record demonstrating product design and analysis capabilities). + Typically 4+ years of product development (or equivalent) experience.
• Knowledge & Skills
• + Strong grasp of mechanical engineering principles; analytical and problem-solving skills; ability to exercise independent judgment.

+ Experience designing electromechanical components, electronic enclosures, mechanical assemblies, structural elements, fluid systems, and/or optical components. + Knowledge of manufacturing processes and joining technologies (e.g., injection molding, die casting, sheet metal, and related joining methods) and mechanical properties of materials. + Mechanical and fluid systems analysis (e.g., tolerances, stress/strain, thermal calculations) using modeling tools. + Proficiency with CAD; high proficiency with CoCreate/OneSpace Designer is a strong plus. + Design for Manufacturability (DFM) and high-volume manufacturing methods; design for reliability. + Knowledge of microfluidics, FAB processes, final assembly methods, and phase-gate product development processes is highly valued (role-dependent). + Demonstrated ability to collaborate effectively with internal teams and external/ODM partners across organizations and geographies; willingness to travel as needed. + Clear written and verbal communication skills; ability to communicate technical concepts, tradeoffs, and status to partners and senior stakeholders. + Growth mindset, creativity, and comfort operating in a start-up-like environment within a larger organization; mentorship opportunities may be available depending on level and assignment. The pay range for this role is

• $93,400
• to •$143,800•USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only).

Pay varies by work location, job-related knowledge, skills, and experience.

• Benefits:

• HP offers a comprehensive benefits package for this position, including: + Health insurance + Dental insurance + Vision insurance + Long term/short term disability insurance + Employee assistance program + Flexible spending account + Life insurance + Generous time off policies, including; + 4-12 weeks fully paid parental leave based on tenure + 11 paid holidays + Additional flexible paid vacation and sick leave (US benefits overview (https://hpbenefits.

ce.alight.com/) ) The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

• Job•Engineering •Schedule•Full time •Shift•No shift premium (United States of America) •Travel•Relocation•No •Equal Opportunity Employer (EEO)•HP, Inc.

provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s). Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence. For more information, review HP's EEO Policy (https://www8.hp.com/h20195/v2/GetDocument.aspx?docname=c08129225) or read about your rights as an applicant under the law here: "

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