BEOL Process Integration Engineer (R&D)

We're at the forefront of an exciting era of semiconductor innovation at Texas Instruments' LFAB in Lehi, Utah home to our state-of-the-art 300mm manufacturing facility now ramping our most advanced 28nm analog and embedded process technology in the heart of the Silicon Slopes. As part of our Advanced Technology Development (ATD) organization, you won't just support production you'll create the technology that makes it possible. From developing the Resolution Enhancement Techniques and OPC models that enable 28nm lithographic patterning, to engineering the precision wet process chemistries that define device performance at atomic scale, ATD engineers are solving the hardest problems in analog semiconductor development. At full production, our fabs will manufacture tens of millions of analog and embedded processing chips every day built on the process technologies you help create and qualify. We're committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in

K-12 STEM

education. In this role, you'll work at the intersection of fundamental research and high-volume manufacturing, turning process innovations into production-ready technologies that power electronics everywhere. Texas Instruments is seeking a

• BEOL Process Integration Engineer
• . In this role, you will drive the integration and development of the overall BEOL in advanced lithography nodes, such as 28/22nm and beyond.
• Primary responsibilities will include:
• + Ownership of the process flow for BEOL that meets physical, electrical, yield and reliability targets + Working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive at an optimized, manufacturable and cost-effective solution + Partnering with the RET team to validate OPC and make improvements, as appropriate + Collaborating with the silicon-package-test interaction (SPTI) team to ensure silicon process is compatible with test and packaging robustness requirementsAs part of this role, you will be accountable for delivering technology solutions on time that meet product requirements.

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

• Why TI?
• + Engineer your future.

We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. + We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012) + Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

• About Texas Instruments
• Texas Instruments Incorporated (

Nasdaq:

TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com . Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition.

• Minimum requirements:
• + Master's degree in Electrical Engineering, Materials Science & Engineering, or related degree + 5+ years of experience in 28nm & below technology with hands-on experience developing BEOL + Demonstrated experience and ability to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries •Preferred qualifications:•+ Ph.

D. degree in Electrical Engineering, Materials Science & Engineering, or related degree + Experience with 28/22nm technology development for BEOL including RRAM (Resistive Random Access Memory), TFR (Thin Film Resistor), MIMCAP (Metal-Insulator-Metal Capacitor), if possible + Ability to establish strong relationships with key stakeholders critical to success, both internally and externally + Strong verbal and written communication skills + Ability to quickly ramp on new systems and processes + Demonstrated strong interpersonal, analytical and problem-solving skills + Ability to work in teams and collaborate effectively with people in different functions + Ability to take the initiative and drive for results + Strong time management skills that enable on-time project delivery

• ECL/GTC Required:

• Yes