Member of Technical Staff, Silicon Photonics Integration Primary Duties & Responsibilities

• Product and system architecture (30%): Own the integration architecture for cont transmission products from component and PIC/EIC interfaces through the optical engine, module, and system. capacity, reach, optical performance, power, thermal, form-factor, cost, reliability, and manufacturability goals into clear specifications and acceptance criteria.
• Cross-domain co-design and integration (25%): Lead design tradeoffs across SiPh PICs, cont DSP/ASICs, drivers and TIAs, lasers and passive optics, high-speed electrical interfaces, package/interconnect, PCB, thermal/mechanical design, and embedded control. Establish interface control, tolerance budgets, and design-review closure across disciplines.
• Performance modeling, validation, and qualification (20%): Develop link budgets, impairment and margin stacks, calibration/monitoring strategies, and predictive models. Define and lead bring-up, characterization, DVT, reliability qualification, correlation, and root-cause investigations at device, assembly, module, and system levels.
• Productization and cross-functional execution (15%): Partner with product, program, manufacturing, test, quality, reliability, firmware, sourcing, foundry, OSAT, contract-manufacturing, and supplier teams to manage technical risks and deliver DFM/DFT, production calibration, yield learning, cost, schedule, and volume-ramp objectives.
• Technology leadership (10%): Shape cont and silicon-photonics technology roadmaps; evaluate emerging architectures and suppliers; support standards, customer, and partner engagements; generate and protect intellectual property; and mentor engineers through rigorous, data-based technical decision making. Education & Experience
• Master's or Ph.D. degree in Electrical Engineering, Photonics, Optics, Applied Physics, or a closely related field; Ph.D. preferred. A bachelor's degree with substantial directly relevant experience may be considered.
• Typically 15+ years of relevant industry experience, including significant technical leadership in optical communication systems and silicon-photonics or photonic-integrated-circuit product development.
• Demonstrated delivery of complex optical hardware through architecture, detailed design, prototype bring-up, design verification, qualification, manufacturing transfer, and volume ramp.
• Experience with cont optical products such as 400ZR/800ZR, cont pluggables, digital cont optics, transponders, or comparable high-speed transmission platforms is strongly preferred.
• Proven success leading matrixed, cross-functional technical teams and resolving high-impact design and productization issues without relying on direct organizational authority. Skills
• Deep knowledge of cont transmitter/receiver architecture, modulation and detection, optical link budgets, OSNR, dispersion, polarization effects, nonlinearities, and DSP/hardware impairment interactions.
• Hands-on knowledge of SiPh PIC characterization and integration with EICs, lasers, fiber attach and optical coupling, advanced package/interconnect technologies, and high-speed electrical interfaces.
• Strong system-level understanding of RF design, signal and power integrity, thermal/mechanical constraints, control/monitor functions, and optical/electrical calibration.
• Ability to create and use analytical and simulation models, structured experiments, statistical data analysis, and automated characterization to drive design decisions and yield learning.
• Working knowledge of DFM, DFT, reliability physics, qualification methods, configuration/change control, failure analysis, production test, and quality systems for high-volume optoelectronic products.
• Demonstrated judgment in requirements decomposition, interface management, architecture trade studies, technical risk management, and design-review leadership.
• Excellent written and verbal communication, including the ability to explain complex technical decisions to executives, customers, suppliers, and multidisciplinary engineering teams.
• Ability to work effectively across global teams and time zones and to travel up to approximately 15% for supplier, manufacturing, customer, or program needs. Working Conditions
• Hybrid, remote, or on-site work arrangement will be determined by the assigned location and business needs.
• Regular work in office and engineering laboratory environments using computers and optical/electronic test equipment.
• Frequent interaction with global engineering, product, manufacturing, supplier, and customer teams.
• Travel up to approximately 15% may be required for supplier, manufacturing, customer, or program activities.
• Occasional schedule flexibility may be required during product bring-up, qualification, issue resolution, and production ramp. Physical Requirements
• Ability to sit or stand for extended periods while working at a computer, in meetings, or in a laboratory.
• Use of hands and fingers for typing and for handling optical, electronic, and mechanical components or test fixtures.
• Ability to move within office, laboratory, and manufacturing environments and to wear required PPE.
• Occasional lifting or moving of equipment, fixtures, or materials weighing up to 20 pounds.
• Ability to communicate effectively in person, by telephone/video, and in writing.

Safety Requirements All employees are required to follow the site EHS procedures and Cont Corp. Corporate EHS standards. Quality and Environmental Responsibilities Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and r...Visit the Employer site for more details