Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while collaborating with internal and external partners throughout the product development lifecycle. BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field. 8+ years of semiconductor package development experience. Proven expertise in embedded packaging, substrate technologies, and advanced interconnects. Strong knowledge of package reliability, failure analysis, and manufacturing processes. Experience with DOE, statistical analysis, and process optimization. Experience working with OSATs, substrate suppliers, and material vendors. Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers. Proficiency in engineering tools and methodologies, including

ACAD, 8D, SPC, DFMEA, DOE.

Proven ability to lead projects across organizations and cultures in a fast-paced environment. Develop embedded package architectures with embedded passives, active devices, and HDI substrates. Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules. Lead process development for embedding, lamination, laser drilling, metallization, and assembly. Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements. Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions. Conduct root cause analysis and implement yield, quality, and cost improvements. Lead cross-functional teams through concept, development, qualification, and production release.