SiC Wafer and Package Technology Development Engineer

SiC Wafer and Package Technology Development Engineer onsemi - 3.8 Scottsdale, AZ Job Details Full-time 3 hours ago Qualifications Project reporting Customer communication Sales support Product development project management Materials engineering within manufacturing Mid-level Technical support Global team management Collaboration with product development teams Industrial plating Packaging Molding process implementation Leading team collaboration initiatives Engineering product development Cross-functional team management Communication skills Project stakeholder communication Cross-functional communication Full Job Description Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi. Responsibilities Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams Understand detailed customer requirements and verify latest technologies meet or exceed all expectations Document findings and process flows to create baseline for new technology platforms Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis. Qualifications Strong communication skills Ability to lead development projects and implement strategies on a global basis Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding Knowledge of materials and material interactions About Us onsemi (

Nasdaq:

ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits About the Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact for assistance.