Package Technology Development Engineer
Job
Cisco
San Jose, CA (In Person)
$205,000 Salary, Full-Time
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Job Description
The application window is expected to close on: 05/08/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Cisco is seeking a seasoned Packaging Technical Leader to join the Packaging Technology & Quality team within our world-class Global Supply Chain. As a Technical Leader you will drive innovation in advanced packaging technology and quality for Cisco's cutting-edge ASIC and silicon photonic products. Your Impact You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and multi-functional environment. This includes close partnerships with design engineering, operations, and supply chain teams to innovate next-generation technologies. You will also engage directly with counterparts at OSATs, Fabs, contract manufacturers and other key suppliers leading technical discussions and problem-solving efforts as well as influencing commodity strategy at a global scale. This role offers significant technical scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms.
Key responsibilities:
- Serve as a technical leader in advanced packaging technology development(2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing.
- Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products.
- Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions.
- Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM.
Minimum Qualifications:
- 7+ years of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable track record of technical leadership and successful project execution.
- Knowledge of advanced packaging processes (bumping, flip-chip, TSV, 2.5D/3D, MCM) and materials
- Experience with package reliability & qualification, FMEA, structured problem solving methods like 8D, and physical failure analysis techniques
Preferred Qualifications:
- Familiar with wafer- and package level-test and debug as well as ATE platforms and test HW.
- Familiarity or experience with co-packaged optics is a plus
- Experience with volume manufacturing
- Experience with advanced simulation tools for package design and reliability analysis
- Ability to work within and lead projects with highly multi-functional and geographically distributed technical teams.
Canada:
The starting salary range posted for this position is $168,800.00 to $241,200.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation- , equity, or benefits.
- receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.
New York City Metro Area:
$168,800.00 - $277,400.00 Non-Metro New York state & Washington state: $148,800.00 - $248,200.00- For quota-based sales roles on Cisco's sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined.
- Employees in Illinois, whether exempt or non-exempt, will participate in a unique time off program to meet local requirements.
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