onsemi is seeking a highly motivated individual to join our Device Engineering / Yield Enhancement group in Gresham, OR. An Engineer in this position will work with other Engineers and Technicians in a fast-paced Silicon wafer fab production and technology development environment. Primary technology nodes range from sub-0.18um to 0.5um. Group responsibilities include Yield Enhancement (both wafer level and die level), Technology Transfers, New Product Introduction, and other production sustaining/optimization activities. This position will build upon your Semiconductor device knowledge across the entire Silicon manufacturing chain (from bare wafers to finished goods), with a significant focus on fab manufacturability. Communication skills will be important, since this position regularly interfaces with in-house Fab Process Engineering, Technology Development, Failure Analysis, Design/Layout, wafer probe/test, in-line defect control, Quality, and Business Unit part owners and managers.

Qualifications:

BS/MS or equivalent in Engineering, with

BSEE/MSEE

preferred. Will also consider Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field Broad understanding of semiconductor devices, such as CMOS, DMOS, and Bipolars 5+ years of experience in semiconductor process technology and wafer fabrication Problem-solving mindset Comfortable using data analysis and statistics to reach conclusions Concise and clear written and oral communication skills Strong interpersonal skills

Desired:

Experience in one or more of the following engineering disciplines: Process/Device Integration, Circuit Design / Simulation, Test (parametric, circuit), Process Engineering Experience with DOE and experiment analysis 10+ years of experience in semiconductor process technology and wafer fabrication Ability to relate product circuit performance to semiconductor device parameters Knowledge of post-fab product manufacturing (ex: assembly, and test) Ability to debug issues at any point in a product manufacturing sequence Hands-on knowledge of GDS layout viewing and editing Responsibilities will include one or more of the following: Yield enhancement for production products New product introduction into the Fab Scrap reduction and prevention. Process improvements using existing and newly acquired process equipment, often working directly with Process Engineering Minimize variation (lot to lot, wafer to wafer, product to product) Lower cost Improve throughput Lower defectivity Standardization / Best Known Methods Analyze manufacturing and test data to improve product performance Ensure all shipped material meets requirements Present trends, KPIs, and process improvements to management team