Principal Engineer Package Concept (Module)
Job
Infineon Technologies
Andover, MA (In Person)
$186,300 Salary, Full-Time
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Job Description
At Infineon, we're powering AI - from the grid to the core, today and in the future - delivering innovative solutions and redefining what's possible in the world of data centers and beyond. As our hashtag#PoweringAI teams continue to grow, we're looking for talented professionals eager to be part of this exciting journey Your Role Key responsibilities in your new role
- Define package concepts for AI power supply products with focus on high-performance computing modules
- Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development and system architects
- Align new ideas and concepts with Back End development (in-house + OSAT) and initiate assembly projects
- Follow up and support package development projects until final release of the product
- Identify new development topics and incorporate them into the package roadmap
- Support our customers with package specific questions
- Stay up to date on package solutions through continuous market screening and competitor analysis
- Identify business opportunities enabled by new technologies and concepts Your Profile Qualifications and skills to help you succeed
- Technical background, e.g. Degree in Physics or Electronics
- 6 years practical experience in assembly technologies with detailed knowledge of Back End processes and materials and their dependencies laminate design/ materials/ processes
- Background knowledge of SMT related technologies
- Experience with typical package design tools (e.g. Autocad/ Cadence)
- Very good communication and presentation skills #WeAreIn for driving decarbonization and digitalization.
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