Laser Technologies, Inc. is looking for a Die set-up / Press Operator for our 6am to 2:30pm shift. Position requirements include but are not limited to a high mechanical aptitude, understanding of ISO procedures, ability to read and decipher blueprints, and at least one year of experience performing die set-ups on small to large stamping and punch presses. This role requires access to export-controlled information; therefore, candidates must meet U.S. Person requirements. Primary Responsibilities
- Operate Compound, Progressive and Notching dies in designated presses
- Set Progression Feed
- Set Leveler/Straightener
- Operate Punch Presses
- Scrap Management
- Part Ejection Management
- Conveyer Setup and Usage
- Troubleshoot/Debug Stamping Issues Knowledge and Skill Requirements
- High Mechanical Aptitude
- Understand ISO Procedures
- Read and Decipher Blueprints
- Read and Comprehend Work Instructions
- Communicate Problems/Solutions and Ideas with Supervisor
- Basic Math Knowledge such as Addition, Subtraction and Fractions
- Knowledge of Hand Tools
- Must be able to use Measuring Equipment such as Micrometers, Calipers and Ruler Measurements
- Must be able to lift minimum of 50 lbs.
- Must have own tools
- Wintress Control or Die Pro 1500 experience a plus
- Must have at least one year of experience performing die set-ups on small to large stamping and punch presses.
- Must be a U.S. Person as defined by
ITAR/EAR
regulations (U.S. Citizen, U.S. National, Lawful Permanent Resident, or protected individual under 8 U.S.C. 1324b(a)(3))
Equal Opportunity Employer:
Race, Color, Religion, Sex, Sexual Orientation, Gender Identity, National Origin, Age, Genetic Information, Disability, Protected Veteran Status, and any other legally protected group status.
Work Location:
Naperville, IL Work Remotely No Job Type:
Full-time Pay:
$30.00 - $35.00 per hour Expected hours: 40.0 per week
Benefits:
401(k) 401(k) matching Dental insurance Health insurance Life insurance Paid time off Tuition reimbursement Vision insurance
Work Location:
In person