Semiconductor Process Applications Engineer at Finetech Semiconductor Process Applications Engineer at Finetech in Gilbert, Arizona Posted in 2 days ago.

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full-time Job description Position Overview We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment. Key Responsibilities Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface. Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities. Collaborate with customers to understand application requirements and develop customized process solutions. Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically. Provide technical training to customers and internal staff on equipment operation and process optimization. Gather customer feedback and work with international engineering teams to drive product improvements and new feature development. Prepare and maintain technical documentation, including application notes, process guidelines, and training materials. Represent the company at industry events, conferences, and customer meetings as a technical expert. Qualifications Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field. Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering. Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment. Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization. Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues. Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences. Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%). Preferred Skills Customer-focused mindset with a proactive approach to solving challenges. Team player able to collaborate across departments and with external partners. Adaptable and eager to learn about new technologies and industry trends. Self-motivated, organized, and able to manage multiple priorities effectively. Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration. Why Join Us? Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package.