Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions - Siemens EDA

Marketing Programs Manager

• 3D IC Design & Advanced Packaging Solutions
• Siemens EDA Siemens
• 4.

0 Santa Clara, CA Job Details Full-time $184,500 a year 20 hours ago Qualifications Marketing analytics

Full Job Description Company:

Siemens EDA Job Title:

Marketing Programs Manager

• 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118

Job Location:

Wilsonville, OR, Santa Clara, CA or Boulder, CO Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design. We are seeking a visionary and results-oriented Marketing Leader to spearhead high-impact, cross-portfolio marketing programs specifically focused on our 3D IC Design and Advanced Packaging Solutions. This pivotal role will advance Siemens EDA's strategic market position in this rapidly evolving and critical domain. Reporting to the Director of Marketing Programs and Communications, you will architect and execute innovative marketing campaigns that amplify Siemens EDA's visibility, thought leadership, and market share in the 3D IC and advanced packaging segments. As a key member of our newly formed strategic marketing organization, you will have high visibility and the opportunity to shape our go-to-market approach across the Siemens EDA portfolio, specifically targeting the unique challenges and opportunities presented by heterogeneous integration and 3D IC architectures.

Key Responsibilities:

Strategic Planning & Leadership for 3D IC/Advanced Packaging Architect comprehensive, data-driven marketing strategies tailored to Siemens EDA's 3D IC design, multi-die integration, and advanced packaging solutions, aligning with growth initiatives and market positioning. Identify emerging platforms, industry trends (e.g., chiplets, wafer-on-wafer, hybrid bonding), and innovative approaches to maximize Siemens EDA's market visibility and competitive differentiation in this specialized area. Articulate the value proposition of Siemens EDA's solutions for addressing critical 3D IC challenges such as thermal management, power delivery, signal integrity, co-design, and verification. Campaign Management & Execution Orchestrate integrated, multi-channel marketing campaigns that deliver measurable business outcomes for our 3D IC and advanced packaging offerings. Ensure consistent brand messaging and visual identity across all marketing assets and touchpoints, highlighting Siemens EDA's expertise in heterogeneous integration. Direct external agencies and vendors to deliver high-quality, on-brand campaign elements, potentially including technical white papers, application notes, and webinars focused on 3D IC methodologies. Cross-functional Collaboration Partner closely with product management, R D, sales, and executive leadership to align marketing initiatives with business objectives for our 3D IC and advanced packaging portfolio. Build strong stakeholder relationships across the organization to drive marketing integration and effectiveness, particularly with teams focused on physical verification, design for test (DFT), and system-level analysis for 3D ICs. Performance Measurement & Optimization Establish key performance indicators (KPIs) to measure campaign effectiveness and return on investment for 3D IC-focused marketing initiatives. Continuously refine marketing approaches based on performance data and market feedback, adapting to the rapid evolution of 3D IC and advanced packaging technologies. Monitor competitor activities and market trends in the 3D IC and advanced packaging space to inform strategic marketing decisions.

Required Qualifications:

Bachelor's degree in Marketing, Business Administration, Electrical Engineering, Computer Engineering, or a related technical field. Deep understanding and passion for 3D IC design, heterogeneous integration, advanced packaging technologies (e.g., 2.5D, chiplets, fan-out), and the associated EDA challenges (e.g., thermal, power, reliability, co-design). Outstanding communication and presentation skills with the ability to influence at all organizational levels, including technical experts and executive leadership. Strong analytical skills with experience in marketing metrics analysis and performance optimization. Willingness to travel domestically and internationally (approximately 20%). Why us? Working at Siemens Software means flexibility

• Choosing between working at home and the office at other times is the norm here.

We offer great benefits and rewards, as you'd expect from a world leader in industrial software. A collection of over 377,000 minds building the future one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow! Siemens Software. Transform the Everyday with Us #LI-EDA #LI-CF1 #

LI-HYBRID 102,500 184,500

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