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Piper Companies is seeking a Substrate Layout Engineer to join a rapidly growing AI infrastructure and semiconductor technology organization. The Substrate Layout Engineer will support the physical layout and routing of advanced organic substrates, interposers, and package technologies for next-generation multi-die compute products designed for high-performance AI and data center applications. The Substrate Layout Engineer requires you to work onsite 5 days per week in Sarasota, CA. Responsibilities of the

Substrate Layout Engineer:

• Perform physical layout of organic substrates and interposers, including die placement, bump-map alignment, netlist implementation, escape routing, signal routing, power routing, reference planes, via structures, and stack-up implementation.
• Develop routing solutions for high-speed interfaces and high-current power delivery networks.
• Support routing feasibility studies and collaborate with package integration, ASIC, signal integrity, power integrity, and mechanical engineering teams.
• Apply and maintain layout constraints while coordinating design reviews with cross-functional stakeholders.
• Perform connectivity verification, DRC, DFM, and manufacturing rule checks.
• Prepare release databases, design documentation, and manufacturing deliverables.
• Work directly with substrate suppliers, fabrication partners, and manufacturing teams to resolve design and manufacturability challenges.
• Support package interface board layout activities and contribute to process improvements and best practices.

Requirements of the

Substrate Layout Engineer:

• 8+ years of hands-on experience with substrate, package, interposer, or complex multilayer PCB layout design.
• Experience with Siemens Xpedition, Cadence Allegro, or comparable package and PCB layout tools.
• Strong knowledge of high-density routing, bump escape techniques, via structures, and stack-up implementation.
• Working understanding of high-speed signal routing and/or power delivery network design.
• Experience performing connectivity checks, design rule checks (DRC), design for manufacturability (DFM), and manufacturing release procedures.
• Ability to collaborate effectively with engineering teams, suppliers, and manufacturing partners.
• Experience supporting multi-die, chiplet-based, or advanced package designs is highly preferred.
• Bachelor's degree in Engineering or equivalent combination of education and relevant industry experience.

Compensation for the

Substrate Layout Engineer:

• Salary range: $180,000 - $270,000 base salary

Full Comprehensive Benefits:

Health, Vision, Dental, PTO, Paid Holiday and Sick Leave if Required by Law.

Keywords:

Substrate Layout Engineer, Package Layout Engineer, Organic Substrates, Interposer Design, Multi-Die Packaging, Chiplet Architecture, Advanced Packaging, High-Speed Routing, Power Delivery Networks, PDN, Signal Integrity, Power Integrity, Bump Escape Routing, Siemens Xpedition, Cadence Allegro, Package Design, PCB Layout, High-Density Routing, DRC, DFM, Manufacturing Release, IC Packaging, Semiconductor Engineering, AI Infrastructure, Data Center Hardware, Package Integration, Advanced Semiconductor Packaging, Electrical Design, Stack-Up Design, Via Structures, ASIC Packaging This job opens for applications on 10/09/2026. Applications for this job will be accepted for at least 30 days from the posting date. #LI-AG1 #REMOTE