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Qorvo (

Nasdaq:

QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

DUTIES:

Lead Integrate Circuit (IC) Packaging Technologies Roadmap for all of the organization's products. Lead the execution of R D Projects for the Short- and Long-Term roadmap. Oversee the development and hiring of highly skilled technical personnel. Lead R D skunkworks technologies for 3+ years roadmap. Ensure that Qorvo manufacturing internal or external sites are ready with leading technology (materials, design rules, new packaging, and equipment capabilities).

This includes working with:

Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing; understanding packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions; systematically maintain technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size; implement a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution; management experience in Packaging and Assembly of Semiconductors, and with System in Packages; assembly process such as SMT, Die Attach, Wire Bond, Molding, Marking, and Shielding; methodologies such as Six Sigma, Lean; and strong High Volume manufacturing experience in semiconductor assembly technologies/products. Includes occasional domestic travel to meet with customers and international trips two to three times a year.

MINIMUM REQUIREMENTS

Bachelor's degree in Electrical Eng.'g., Mechanical Eng.'g., Semiconductors, Materials, or Electronic Engineering, or related field, and 12 years of experience stated herein to involve: (1) Assembly Processes, IC Packaging Technologies, and High-Volume Manufacturing; (2) understanding packaging technologies for diverse packages to include four of the following: DSMBGA, DSMLGA, LGA, MCM, WLCSP, or Leadframe, etc., for addressing company needs & offer cost-quality effective solutions; (3) Systemic Design Rule Improvement Plan to include systematically maintain technology leadership on packaging design rules for optimizing modules in terms of performance, cost of ownership & size; (4) Systemic packaging technology development to include implementing a system for ideating, qualifying & deploying technologies for smooth New Product Introduction execution. Additionally, 10 years of experience stated herein to involve: (a) Management experience in Packaging and Assembly of Semiconductors, and with System in Packages; (b) assembly process such as SMT, Die Attach, Wire Bond, Molding, Marking, and Shielding; (c) methodologies such as Six Sigma, Lean; and (d) strong High Volume manufacturing experience in semiconductor assembly technologies/products. Includes occasional domestic travel to meet with customers and international trips two to three times a year. This position is not eligible for visa sponsorship by the Company.

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.