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Fabrinet
Process Engineer - Advanced Packaging
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Job Description
Process Engineer
- Advanced Packaging Fabrinet
- 4.2 Santa Clara, CA Job Details $120,000
- $140,000 a year 12 hours ago Qualifications Bachelor's degree in mechanical engineering Measurement-based inspection Assembly quality control testing Defect resolution root cause analysis Bachelor's degree in electrical engineering Bachelor's degree in Physics Mechanical design Bachelor of Science Defect analysis Design of manufacturing processes Mechanical Engineering Tooling design Master's degree Optics Assembly Bachelor's degree in engineering Master's degree in mechanical engineering Physics Quality control problem-solving Cleanroom experience Manufacturing Engineering Fiber optic splicers Instrumentation-based inspection Electrical Engineering Ordering supplies Prototypes Python Entry level Data analysis software Failure analysis Full Job Description Fabrinet West•
Santa Clara, CA, United States PURPOSE:
To support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)
PRINCIPLE ACCOUNTABILITIES / DUTIES
Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom. Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment. Create, improve and document optical splicing and routing for fiber optics box build assembly. Lead root cause analysis and corrective actions for process excursions. Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies. Design and order necessary tooling and ensure availability of all consumables
PREVIOUS EXPERIENCE REQUIRED
( include experience required with specific software applications, equipment, or specific certifications and education requirements such as MSME, MSEE, APICS, etc)
PREFERRED
Qualifications (nice to have skills): 0-1 year experience in cleanroom manufacturing environment Understand principle for die bonding in microelectronics Basic Programming python, Excel for data analysis
Education or Training:
- BS degree required in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Optical Engineering, or Physics. Compensation $120
- 140k/annually
Posted:
Monday, September 28, 2026 Job # 832