View More Jobs Principal Process Integration Engineer United States (Onsite) The Principal Process Integration Engineer is responsible for ensuring the quality, reliability, and yield of InP-based Photonic Integrated Circuit (PIC) products. This role plays a key part in ramping high-volume production and works cross-functionally to troubleshoot and optimize wafer fabrication processes, resolve yield issues, and support next-generation PIC platform development. Your responsibilities

• Own wafer quality and yield using deep knowledge of fab processes, device physics, and test/reliability data
• Analyze process deviations and test failures to identify root causes and implement corrective actions
• Establish, maintain, and monitor inline fab process specifications and capability (CPK)
• Drive yield improvement initiatives from concept through qualification and production release
• Define design rules and develop test structures for effective process control
• Support technology development, transfer, and manufacturing ramp for next-generation PIC platforms
• Partner with Process Engineering to improve process stability and capability
• Collaborate with Operations to improve throughput and reduce cycle time Your skills and experience
• MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field
• 10+ years of experience in semiconductor wafer fabrication
• Hands-on experience with III-V processes, including epitaxy, wet and dry etching, photolithography, and metal deposition
• Strong understanding of semiconductor processes and device physics
• Proven analytical and problem-solving skills with proficiency in data analysis tools (e.g., JMP, Python)
• Experience with SPC, DOE, and yield optimization methodologies
• Excellent communication skills with the ability to present technical work to diverse stakeholders At Nokia, we want every candidate to be able to perform their best.

If you need any adjustments or support during the recruitment process, please let us know. All requests are treated confidentially. Apply Now Job Info Job Category Direct Production Posting Date 08/31/2026 Degree Level Master's degree Job Schedule Full time Job Type Experienced Job Identification 40160 Will

NSA/CAPS

approval be required? (E.g., accessing a US Customer Network?) No Role Type Individual contributor Laptop - support with ordering needed Yes Salary Range $130k to $240k

• Plus, potential incentive/variable compensation for eligible roles.

Experience level Experienced Locations 1322 Bordeaux Drive, Sunnyvale, California, 94089-1005, US 6373 San Ignacio Avenue, San Jose, California, 95119-1200, US (Onsite) Regular or Temporary Regular Legend Jobs at a location Group of locations © Oracle Corporation Terms Legal Notices Use control and scroll to zoom the map Use two fingers to move the map Similar Jobs Process Integration Engineer United States (Onsite) Posted on 08/03/2026

Title:

Process Integration Engineer Nokia Inc in Sunnyvale, CA has a wafer fab which carries out R D and production of state-of-the-art indium phosphide (InP) photonic integrated circuit (PIC) semiconductor chips. The wafer fab operates 24x7 and provides the opportunity for integration technicians to improve quality and reduce defects in our fab processes. Nokia's fab processes include photolithography, wet etch, plasma etch, metal deposition, and chemical vapor deposition. Integration engineers and technicians have an exciting career in advancing the performance and yield of Nokia's current and future generations of high speed, optical networking, semiconductor devices. Nokia's culture supports strong teamwork and excellent training by co-workers.

Work Hours:

Weekday morning shift. Compressed work week. Every Monday, Tuesday, Wednesday and other Thursday 05:00AM to 05:00 PM (Career Fair) Process Integration Engineer United States (Onsite) Posted on 08/17/2026

Title:

Process Integration Engineer Nokia Inc in Sunnyvale, CA has a wafer fab which carries out R D and production of state-of-the-art indium phosphide (InP) photonic integrated circuit (PIC) semiconductor chips. The wafer fab operates 24x7 and provides the opportunity for integration technicians to improve quality and reduce defects in our fab processes. Nokia's fab processes include photolithography, wet etch, plasma etch, metal deposition, and chemical vapor deposition. Integration engineers and technicians have an exciting career in advancing the performance and yield of Nokia's current and future generations of high speed, optical networking, semiconductor devices. Nokia's culture supports strong teamwork and excellent training by co-workers.

Work Hours:

Weekday morning shift. Compressed work week. Every Monday, Tuesday, Wednesday and other Thursday 05:00AM to 05:00

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