Microbond Process Engineer

Microbond Process Engineer 4.4 4.4 out of 5 stars Corvallis, OR 97330 Full-time RLA Engineering, LLC 17 reviews

Full-time Job Title:

Microbond Process Engineer Employee Type:

MSP Expected Weekly Hours:

40

Relocation Assistance:

Available Position Summary This position is responsible for supporting various wafer bonding processes (microbond WC) for the high-volume fabrication of MEMS (silicon wafer). The candidate will use their understanding of fabrication processes and product development methodologies to achieve the yield goals of assigned toolset/process step(s). The wafer fab process engineer will collaborate with product R D teams to make decisions on process quality based on data and statistical analysis. Duties and Responsibilities Develop fundamental understanding of assigned fabrication processes and product development methodologies against target yields Determine wafer surface preparation and pre-bond cleaning requirements (plasma, wet cleans, dehydration bakes) to achieve high bond strength and low defectivity Confirm bond alignment, bond tool operation, and post-bond thermal processing (bakes/cures) to ensure mechanical integrity and yield Collaborate with: • Other process and tooling engineers to execute process characterization, optimization, and margin studies including SPC, DOE, yield analysis, and defect reduction •Equipment engineering, integration, and quality teams to drive process stability and continuous improvement Contribute to FA by troubleshooting bond-related excursions such as delamination, voiding, particle-driven defects, and thickness non-uniformity Support NPI, process transfer, and documentation (work instructions, process flows, FMEA, and control plans) Occasionally work 40+ hours in a week to meet certain team milestones Perform other duties as needed Education and Credential Requirements Bachelor's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field Eligible to work in the US without RLA sponsorship for employment visa status Experience Requirements 3-5 years of experience in a wafer bonding process engineer role Wafer bonding processes supporting volume manufacturing and R D environments Wafer-to-wafer and wafer-to-carrier bonding (e.g., direct bond, adhesive bond, oxide bond, plasma/anodic bond) used in MEMS and advanced device integration Familiar with IR inspection, metrology, and cross-section analysis to evaluate bond voids, alignment accuracy, and interface quality Use of Quality Systems, Statistical Process Control, Design of Experiments, and basic statistical data analysis on tooling design, process development, and improvements Preferred experience: • Worked on MEMS products • Collaboration with Mechanical Tooling and Process Engineers on designing custom jigs/fixtures for wafer handling Skills Requirements Ability to read, write, and speak English proficiently High proficiency using productivity software such as M365 (Word, Outlook, Excel, PowerPoint, Visio, Teams and SharePoint) Ability to use agile/scrum project/program management principles and methodologies to consistently meet task deadlines, triage changing priorities, and track issues to resolution Ability to collaborate across diverse teams with a customer service mindset Work Environment The position typically operates in a standard office environment and/or from employee's home Be able to lift and/or move up to 25 pounds

Benefits:

401(k) Dental insurance Health insurance Paid time off Relocation assistance Vision insurance

Work Location:

In person