A Vice President of Engineering is responsible for providing leadership in planning, establishing and directing all aspects of the company's engineering policies, objectives and initiatives based on product and profitability goals. Responsible for supplying and maintaining adequate resources for Engineering functions in the pursuit of the company's strategic goals and operational plans.
Vice President Hardware Engineering at Teksky LLC Vice President Hardware Engineering at Teksky LLC in Campbell, California Posted in 1 day ago.
Type:
full-time
Job Description:
VP of HW Systems Engineering Job Summary We are seeking an agile, results-driven VP of HW Systems Engineering to lead our hardware organization. In this highly visible role, you will own the hardware product lifecycle from concept to high-volume production for Trusted Control/Compute Unit (TCU) products. This role requires an executive with elite, hands-on design and debugging capabilities who thrives in the lab and effectively navigates dynamic, supplychain-constrained environments. You will manage senior engineers and contractors, help customers build secure server infrastructure, and champion open hardware ecosystems such as the Open Compute Project (OCP) .
Key Responsibilities Leadership & Execution:
Drive TCU-based embedded systems from initial concept through high-volume production with active, hands-on daily execution.
Mass Production & Yield:
Take complex board designs to mass production while optimizing DFM/DFT , factory test coverage, and production yields.
Sustaining & RMA Support:
Oversee the technical resolution of customer field returns, driving Failure Analysis (FA) and corrective actions to improve reliability.
Root-Cause Triage:
Partner with cross-company ASIC, silicon, firmware, and software teams to systematically isolate and resolve complex system bugs.
Lab Validation:
Personally lead first-silicon and platform bring-up, low-level bus validation, and EVT/DVT testing in the lab.
OCP & Industry Forums:
Integrate
OCP DC-SCM
standards and represent the company within OCP and other industry hardware forums.
Supply Chain Agility:
Pivot board layouts responsively based on real-time parts availability and manage critical Tier-1 supplier relationships.
Design & Review:
Drive schematic development using Cadence OrCAD and collaborate with Layout, Mechanical, and SI engineers to meet OCP DC-SCM and
NVIDIA IFF
form factors.
Qualifications Experience & Education:
20+ years of hardware engineering experience with a leadership track record in server, data center, or semiconductor ecosystems . B.S. or M.S. in Electrical Engineering (EE).
Production Track Record:
Proven history of taking complex board designs to high-volume production with excellent yields and resolving field RMA issues.
Hands-on Technical Mastery:
Deep, continuous experience with circuit design, schematic capture, laboratory equipment, and platform troubleshooting.
DC-SCM & Ecosystem Expertise:
Strong knowledge of
OCP DC-SCM
standard solutions, including DC-SCI interfaces and form factors, along with a solid network across hyperscaler and OEM partners.
Supply Chain Agility:
Demonstrated capability to execute rapid hardware redesigns, footprint compatibility strategies, and alternative component sourcing.
Tool & Interface Proficiency:
Expert familiarity with Cadence OrCAD/Allegro and server interfaces including PCIe, USB, I2C, SMBus, SPI, UART, MCTP, eSPI, and LTPI .
Architecture & Software Knowledge:
Solid understanding of modern CPU/GPU architectures and the Linux environment, including Python or Bash scripting.
Communication:
Exceptional verbal and written communication skills to articulate hardware-anchored security and supply chain strategies to enterprise stakeholders.
