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QP TECHNOLOGIES

Wirebond Engineer

Career Insights for Integrated Circuit (IC) Design Engineer

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What they do

An Integrated Circuit (IC) Design Engineer designs and develops integrated circuits used in electronic devices and communications systems. Designs circuitry and builds circuitry frameworks for products and systems.

$169,969 / year median in California

+2% projected growth

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Job Description

Wirebond Engineer
QP TECHNOLOGIES
Escondido, CA Job Details Full-time $95,000 - $115,000 a year 3 hours ago Benefits Health savings account Health insurance Dental insurance 401(k) Flexible spending account Tuition reimbursement Employee assistance program Vision insurance 401(k) matching Employee discount Life insurance Referral program Qualifications Teamwork Six Sigma Green Belt Quality control statistical data analysis Design of experiments Statistical Process Control Electrical engineering Attention to detail Data interpretation Electrical Engineering Semiconductor experience Cross-functional communication Full Job Description Job Summary We are seeking a highly skilled and motivated Wirebond Engineer to join our dynamic engineering team. In this role, you will be at the forefront of advanced electronic packaging and assembly, specializing in wirebonding techniques critical for high-performance semiconductor devices and integrated systems. Your expertise will drive innovation in electrical interconnections, ensuring the reliability and efficiency of our cutting-edge products. This position offers an exciting opportunity to work on complex projects involving PCB design, system development verification, and manufacturing processes, all while contributing to the development of next-generation electronic systems.
Position Summary:
The Wire Bond Engineer is responsible for developing, optimizing, and maintaining wire bonding processes used in semiconductor packaging and microelectronics manufacturing. This role focuses on improving product quality, process capability, yield, reliability, and manufacturing efficiency while supporting new product introductions and production operations.
Essential Duties:
Other Duties & Responsibilities (Optional)
  • Develop, qualify, and optimize wire bonding processes for semiconductor packages
  • Perform process characterization, DOE (Design of Experiments), and root cause analysis to improve yield and reliability.
  • Define process parameters, work instructions, specifications, and control plans.
  • Support new product introduction (NPI) in a high mix manufacturing line.
  • Deploy / use industry best practices for process set up, control and changeovers
  • Analyze SPC data and identify opportunities for continuous process improvement.
  • Collaborate with Quality, Production and Engineering teams to resolve issues.
  • Lead corrective and preventive actions (CAPA) for process-related issues.
  • Ensure compliance with customer, industry, and internal quality standards.
  • Train technicians and operators on wire bonding processes and best practices.
Minimum Qualifications:
  • Bachelor's degree in electrical engineering, Mechanical Engineering, Materials Science, Semiconductor Engineering, or related field.
  • 5+ years of experience in wire bonding, semiconductor packaging, or microelectronics manufacturing.
  • Hands-on experience with automatic wire bonders (gold, copper, aluminum wire bonding).
  • Knowledge of wire bonding principles, semiconductor assembly and package technologies.
  • Experience with statistical tools such as SPC, DOE, and FMEA.
  • Strong problem-solving and data analysis skills.
  • Excellent communication and teamwork abilities.
Key Competencies:
  • Wire Bond Process Development
  • Semiconductor Packaging
  • Failure Analysis
  • Yield Improvement
  • Root Cause Analysis
  • SPC & Process Control
  • Disciplined with excellent attention to detail and robust process control
Preferred Skills:
  • Experience with advanced packaging technologies, including BGA, QFN, SIP, and Flip Chip.
  • Familiarity with SEM, failure analysis techniques, and reliability testing.
  • Knowledge of Lean Manufacturing and Six Sigma methodologies.
  • Green Belt or Six Sigma certification preferred.
Join us to be part of a forward-thinking team dedicated to pushing the boundaries of electronic innovation! Your expertise will directly impact the reliability and performance of our products while advancing your career in a vibrant engineering environment committed to excellence.
Pay:
$95,000.00 - $115,000.00 per year
Benefits:
401(k) 401(k) matching Dental insurance Employee assistance program Employee discount Flexible spending account Health insurance Health savings account Life insurance Referral program Tuition reimbursement Vision insurance
Work Location:
In person

Benefits

  • Financial Aid/Assistance
  • 401(k) Plans
  • Health and Wellness Programs
  • Health Insurance