Semiconductor Packaging Design Engineer

Semiconductor Packaging Design Engineer Orlando, FL 32810 Up to $180,000 a year

• Full-time Up to $180,000 a year
• Full-time
• Relocation Assistance provided for the right candidate
• Elite Connector is excited to partner with a worldwide leader in the Semiconductor industry to find a Package Design Engineer near Orlando, FL.

Essential Duties and Responsibilities:

The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization Layout of a Semiconductor Package that involves flip chip dies, wire bond dies, resistors, capacitors, on a substrate (primarily ceramic, sometimes organic)

• Using tool like Cadence Allegro Advanced Package Designer Plus (APD+)
• Ability to take Schematic & NET List as input and start the Layout
• Ability to do Schematic Capture based on PDF or sketch is added bonus (This is 75% of this role) Package Lid Design
• done in Solidworks Electrical Simulations (done in add-on Modules like Cadence Celsius PowerDC, Sigrity PowerDC) Mechanical analysis
• structural & Thermal
• usually done in Ansys tool Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up Work with IC design team to define IC package requirements Design package layout using standard CAD tools Extract package parasitics and conduct PI/SI analysis

Preferred Knowledge, Skills, And Abilities Layout:

Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.

Analysis:

Celsius PowerDC (IR Drop)

Sigrity Advanced SI II:

Analysis tools for Signal integrity of parallel busses ( DDRx) and serial links (PCIe Gen x), including Package and PCB effects

Sigrity Advanced PI II:

Power Integrity tools ( IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects RF / Microwave Design AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development Requirements Qualifications Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. 5+ years of experience in semiconductor packaging design, modeling, and simulations Strong authority on Cadence Allegro Package Designer Plus (APD+) Experience on interposer and substrate layouts and design in advanced package technologies Experience with 2.5D, 3D package design Experience with design teams on floor plan, bump and layout optimization Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated Record of success in cross-functional team environment Good experience with SI/PI tools for package level extraction/simulation

Job Type:

Full-time Pay:

Up to $180,000.00 per year

Benefits:

401(k) Dental insurance Health insurance Life insurance Paid time off Relocation assistance Retirement plan Vision insurance Application Question(s): Do you have experience in layout of a Semiconductor Package that involves flip chip dies, wire bond dies, resistors, capacitors, on a substrate (primarily ceramic, sometimes organic)

• Using tool like Cadence Allegro Advanced Package Designer Plus (APD+)? Do you have experience in package Lid Design
• done in Solidworks?

Work Location:

In person