Qorvo (

Nasdaq:

QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Qorvo's Internship Program is designed for college students currently enrolled in an accredited Bachelor's, Master's, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available. Qorvo's Internship Program offers: Challenging, skill-building assignments Mentoring and coaching from industry experts Launch & Learns and other learning opportunities Collaborative team-based work environment Networking and social events Final presentation to business leaders Qorvo's Packaging Engineering Internships are offered in our Global Operations business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Responsibilities may include:

Learn about Advanced Packaging and Substrate Technology Development projects methodologies

• to help and improve the process Learn about Substrate Design Rules and Manufacturing Processes
• Foster and mentoring Review Assembly and Marking diagram
• look for opportunities to improve Plan and execute Design of Experiments in support of project deployment Onsite hands-on learning semiconductor assembly processes
• Other minor activities related to documentation and continuous improvement (A3s
• Lean)

Qualifications:

BS in Materials Science, Chemical, Mechanical, or Electrical Engineering Mechanical/Material/Chemical/Electrical Engineering skills Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred Experience with PCG Design Software (i.e. Altium, KiCAD, etc.) is preferred Communication and presentation skills Ability to manage and drive problem resolution Demonstrate strong analytical thinking skills 3.0 GPA or higher This position is not eligible for visa sponsorship by the Company. Competitive hourly pay commensurate with experience: $31/hr

• $42/hr (subject to change dependent on physical location) Posted salary ranges are made in good faith.

Qorvo reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as external competitiveness and internal comparability. Base compensation is one element of Total Rewards offered at Qorvo. More information on the Total Rewards package can be shared upon request.

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets

• we are a place to innovate and shape the future of wireless communications.

It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us. We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.