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Majestic Labs ai
Thermal Engineer - SoC to Rack Integration
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What they do
A Thermal Engineer specializes in in thermodynamics used in the fields of heat transfers and energy conversion.
$139,609 / year median in California
+9% projected growth
Job Description
About Majestic Labs We're a fast-moving, US-Israeli AI startup building next-generation infrastructure for the world's most demanding AI workloads. Our mission is to accelerate the future of intelligence and make it ubiquitously accessible by delivering full stack custom AI servers optimized for large-scale inference and training. Backed by top-tier investors and led by industry veterans, we're scaling rapidly. We seek forward-thinking engineers and operators who thrive in a collaborative environment and excel at solving complex challenges from first principles. If you want to build infrastructure that fundamentally changes what the world can accomplish with AI, come join us! About The Position We are seeking a Senior Thermal Engineer with 10+ years of experience to own the full thermal design lifecycle of advanced cooling systems for high-performance computing hardware. This is an on-site, individual contributor role for a candidate with deep hands-on expertise in liquid cooling architecture from silicon-level cold plate design through rack-scale fluid infrastructure, CFD simulation, and AI/GPU-based system design. Responsibilities Own end-to-end thermal design from concept through production, spanning SoC-level cold plate development through rack-scale liquid cooling infrastructure, including hybrid air and liquid cooling systems. Design and optimize high-power silicon cold plates, including internal micro-channel geometry, thermal interface integration, and fluid inlet/outlet configuration directly at the SoC package level. Architect and validate rack-level liquid cooling infrastructure including manifold layout, blind-mate quick disconnect integration, and full loop pressure and flow management. Drive CFD simulation efforts to validate cooling strategies for high-density nodes, optimizing fluid flow, pressure drop, and heat transfer from chip to rack. Partner closely with internal hardware teams and external partners to deliver integrated thermal solutions for AI/GPU-based platforms.